According to Kuai Technology citing related reports, memory chip manufacturer Kioxia issued another product discontinuation notice to customers on the 31st, announcing the gradual phase-out of certain traditional Floating Gate 2D NAND and third-generation BiCS FLASH products.

The affected products specifically include Floating Gate and BiCS Flash Gen3 wafers, BGA, TSOP, eMMC, UFS, and standard SD cards based on 32/24/15nm processes (SLC/MLC/TLC).

Kioxia stated that the deadline for the Last Time Buy (LTB) forecast is September 30, 2026, with the final shipment date set for December 31, 2028. This means Kioxia will formally exit the 2D NAND market by 2029.

On March 31, Onsemi announced its formal China strategy, clarifying a more focused approach to deepen its presence in the country. By empowering regional leadership, expanding manufacturing partnerships, and deepening local collaboration, Onsemi aims to further help customers accelerate their global business expansion.

As a core part of this strategy, Onsemi officially established Shanghai as its Greater China headquarters and plans to appoint a China General Manager to enhance local leadership, decision-making efficiency, and deepen cooperation with stakeholders.

The strategy is being implemented through four key pillars: Design in China, Manufacture in China, Deepen Roots in China, and Expand Globally.

According to the Economic Daily Newsof Taiwan, China, on March 30, IC design companies including Sitronix, Ilitek, Novatek, Fitipower, Raydium, and Himax have indicated upcoming price increases, with some products rising by up to 20%.

Industry sources noted that Sitronix and Ilitek will raise quotes for display driver ICs effective April 1. Novatek is set to increase prices for its T-CON (timing controller) product line, with Fitipower and Raydium following suit. Himax is also planning a price hike for its TDDI (Touch and Display Driver Integration) products.

According to reports, Puya Semiconductor (Puyan Co., Ltd.) issued a product price adjustment notice on the evening of March 31, 2026, deciding to increase prices for its general-purpose MCU products effective April 15, 2026.

The primary reasons cited are continuous price increases from upstream suppliers, rising packaging and testing raw material costs, and tight capacity supply. The company stated that after careful management assessment, this decision was made to ensure stable and reliable product delivery capabilities while providing customers with sustainable, high-quality service.

According to IT Home citing Korean media, Samsung Electronics' NAND flash fab in Xi'an, China, recently completed a process upgrade and has successfully achieved mass production of its 236-layer 8th-generation V-NAND (V8).

The upgrade process began in 2024, aimed at transforming the original V6 (128L) NAND production to improve performance and manufacturing efficiency, enhancing capacity competitiveness to meet the demand for high-performance storage in the AI era.

Following the mass production of V8, the next step for the Xi'an fab is to target 286-layer V9 NAND. The related production line will be located in the X2 factory, with plans to complete the transition and achieve mass production within 2026.

Optical semiconductor manufacturer Lumentum announced on March 26 that it will convert the wafer fab acquired from Qorvo in Greensboro, North Carolina, to specialize in producing indium phosphide (InP)-based advanced optical devices, including CW lasers and ultra-high-power lasers.

The fab is expected to begin mass production by mid-2028, with NVIDIA slated as its first major customer. Lumentum plans to invest hundreds of millions of dollars over the next few years to expand capacity. This investment aims to enhance supply chain resilience and deepen cooperation with strategic partners to meet the growing demand for high-performance optical components driven by the AI revolution.

According to Kuai Technology, GigaDevice announced on March 31 that the company and its subsidiaries plan to purchase DRAM-related products produced by ChangXin Group on a foundry basis in 2026, with estimated annual transactions reaching RMB 5.711 billion. This represents a 4.83x increase compared to the RMB 1.182 billion in actual transactions between the two parties in 2025.

The transactions involve related parties including ChangXin Memory and ChangXin Technology. GigaDevice stated that the significant increase in procurement is mainly due to the expansion of its niche DRAM business scale and rising foundry costs resulting from the current upward cycle in DRAM market prices.

As a Fabless memory supplier, GigaDevice's cooperation with ChangXin Group, which has IDM capabilities, aims to secure key capacity support, enrich its product portfolio, and enhance its competitiveness in the niche DRAM segment.

According to Kuai Technology, major home appliance brands including Haier, Midea, Hisense, TCL, Siemens, and Panasonic have recently issued price increase notices, announcing price hikes for their products starting in April. The overall industry increase ranges from 5% to 20%, with some Midea air conditioner models seeing increases of up to 30%, marking a new round of cost-driven price increases in the home appliance market.

The price adjustments cover multiple categories including air conditioners, refrigerators, TVs, and kitchen appliances. While offline channels have not fully implemented the new prices, and some high-end new models are only available offline, online models have already begun adjusting prices.

The core reason for this round of price hikes is a significant rise in raw material costs. Copper prices have exceeded RMB 95,000 per ton, while the prices of key materials such as aluminum, plastics, and crude oil have also risen, directly increasing the production costs of white goods like air conditioners and refrigerators. Air conditioners, which use large amounts of copper, are the most affected. TV categories are impacted by rising chip prices; Hisense, which uses self-developed chips, has seen relatively smaller price increases offline.