1. Onsemi Reported to Raise Prices Effective April 1
It is reported that Onsemi has officially announced a price increase, effective April 1, 2026. The adjustment applies to all new orders placed on or after this date, as well as existing backlog orders scheduled for shipment from April 1 onwards. The hike primarily targets power devices and analog chips used in power management, industrial control, and data center applications.
The company cites rising costs of raw materials, manufacturing, energy, and infrastructure as the main drivers. Strong demand from end markets like data centers, new energy vehicles, and industrial automation, coupled with tight capacity, has also necessitated continued investment in manufacturing capacity and operational resilience.
2. MPS Reported to Raise Prices Effective May 1
Monolithic Power Systems (MPS) is reported to have issued a price adjustment letter on March 17, 2026, announcing price increases for certain products effective May 1, 2026. All orders shipped on or after this date will be subject to the new pricing.
This move is part of a broader wave of price hikes across the semiconductor supply chain in early 2026, driven by rising raw material and manufacturing costs. As a leading power management IC supplier, MPS's adjustment reflects intense demand for high-performance power chips in AI servers and new energy vehicles, exacerbating structural capacity constraints.
3. Fortior Tech and CHIPSEA Price Hike Updates
Fortior Technology issued a notice on March 17, 2026, announcing a price adjustment for all its products effective April 1, 2026. The company states that persistent tightness in industry capacity means current prices can no longer guarantee future supply and delivery. The exact increase varies by product specification and model.
CHIPSEA Technology has also circulated a notice, raising prices for its relevant products by 10%–20% effective March 2, 2026. The increase is attributed to significant global rises in the cost of core raw materials and key metals, leading to higher wafer and packaging expenses. Specific model adjustments require confirmation with sales managers.
4. Murata Initiates Price Hikes for Key Components
Murata Manufacturing has announced a comprehensive price increase of 15%–35% for its AI server and high-end automotive MLCC products, effective April 1, 2026. The hike also affects four other product categories: multilayer chip ferrite beads, power inductors, RF inductors, and common mode chokes.
As the world's largest MLCC supplier, holding over 40% of the global market and approximately 70% of the AI server MLCC segment, this marks Murata's first large-scale price adjustment in nearly three years. This move is seen as a potential indicator of a new upward cycle in the global passive component market.
5. Mature Process Foundries Reportedly Raising Quotes
Following memory and packaging, the semiconductor chain may see a new wave of hikes from mature process foundries. UMC, VIS, and PSMC are expected to raise quotes by up to 10% or more, with the earliest effective date being April 2026.
While UMC has not officially confirmed the rumors, it acknowledged a more favorable pricing environment. VIS has issued a notice for an April adjustment without disclosing the rate, and PSMC confirmed it has begun raising prices for product lines with lower margins. This has prompted downstream IC design houses, particularly those making display driver ICs, to plan their own price increases to offset costs.
6. TSMC and Samsung Raise Prices on 5/4nm Nodes
According to TrendForce, both TSMC and Samsung Foundry have increased prices for their key 5/4nm advanced processes, which are crucial for AI chips. Demand from North American cloud service providers and AI startups continues to drive these nodes to full capacity.
TSMC has raised prices across its 5/4nm, 3nm, and 2nm portfolios, with visibility extending into 2027, suggesting the potential for consecutive annual hikes. Samsung issued a price increase notice in Q4 2025 for its 5/4nm processes due to a significant increase in order scale.
7. Kioxia Discontinues TSOP Products, Affecting MLC Flash
Kioxia has notified customers of the discontinuation of its TSOP-packaged NAND flash products, affecting densities from 1Gb to 64Gb, primarily MLC flash. The last order date (LTB) is set for September 15, 2026, with the final shipment date (LTS) on March 15, 2027.
This follows Samsung's earlier EOL announcement for MLC products. After Kioxia's exit, Macronix is expected to become one of the few remaining global suppliers of low-density MLC and eMMC solutions post-2028.
8. Mitsui Plans Price Hike for Ultra-Thin Copper Foil
Mitsui Mining & Smelting is negotiating with customers to raise prices for its MicroThin ultra-thin copper foil, a key material for AI server substrates. The specific increase has not been disclosed.
To meet strong demand, Mitsui is expanding production. It aims to increase monthly MicroThin capacity by 6% to 5.2 million square meters by fiscal 2027, and further to 5.6 million square meters by fiscal 2029.
9. Micron Reports Blowout Q2 FY2026 Results
Micron reported fiscal Q2 2026 revenue of $23.86 billion, up approximately 196% year-over-year. GAAP net income surged 770.8% to $13.785 billion, with gross margins expanding dramatically to 74.4%.
DRAM revenue grew 207% YoY with pricing up 65%-67% sequentially. NAND revenue grew 169% YoY with pricing up 75%-79% sequentially. For Q3, Micron guided for a midpoint revenue of $33.5 billion and gross margins of approximately 81%. The company also raised its FY2026 capex guidance from $20 billion to $25 billion, with FY2027 capex expected to increase by an additional $10 billion or more.
Upload BOM
My Account
