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IC Sockets
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
08-810-90CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
2,235 | 8.32 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
40-C182-10CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
3,536 | 10.34 |
|
Datasheet |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
16-810-90CCONN IC DIP SOCKET 16POS GOLD Aries Electronics |
4,088 | 12.69 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
18-6810-90TCONN IC DIP SOCKET 18POS TIN Aries Electronics |
4,970 | 14.22 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole, Right Angle, Vertical | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
|
28-516-11CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics |
2,414 | 16.22 |
|
Datasheet |
516 | Bulk | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
16-2820-90CCONN IC DIP SOCKET 16POS GOLD Aries Electronics |
2,477 | 12.78 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
|
28-526-11CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics |
3,793 | 18.76 |
|
Datasheet |
Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
|
44-547-11CONN SOCKET SOIC ZIF 44POS GOLD Aries Electronics |
3,261 | 219.36 |
|
Datasheet |
547 | Bulk | Active | SOIC, ZIF (ZIP) | 44 (2 x 22) | - | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
|
84-537-21CONN SOCKET PLCC ZIF 84POS GOLD Aries Electronics |
1,592 | 316.53 |
|
Datasheet |
537 | - | Active | PLCC, ZIF (ZIP) | 84 (4 x 21) | 0.100" (2.54mm) | Gold | 12.0µin (0.30µm) | - | Surface Mount | Closed Frame | - | - | - | - | - | - | - |
|
14-8400-10CONN IC DIP SOCKET 14POS TIN Aries Electronics |
2,016 | 3.86 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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