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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    40-0518-11

    40-0518-11

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    		 1,124 6.68
    RFQ
    		40-0518-11

    Datasheet

         		518 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-526-10

    24-526-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,595 11.69
    RFQ
    		24-526-10

    Datasheet

         		Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6554-10

    24-6554-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 3,655 13.33
    RFQ
    		24-6554-10

    Datasheet

         		55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-526-10

    40-526-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 3,671 15.18
    RFQ
    		40-526-10

    Datasheet

         		Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-6554-10

    28-6554-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    		 1,337 15.22
    RFQ
    		28-6554-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    25-0503-30

    25-0503-30

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    		 3,420 14.39
    RFQ
    		25-0503-30

    Datasheet

         		0503 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    24-6554-11

    24-6554-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 2,539 19.43
    RFQ
    		24-6554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6554-10

    48-6554-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 4,151 19.99
    RFQ
    		48-6554-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6554-11

    40-6554-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,308 27.86
    RFQ
    		40-6554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    108-PRS12005-12

    108-PRS12005-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 3,312 81.03
    RFQ
    		108-PRS12005-12

    Datasheet

         		PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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