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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
10-2513-10

10-2513-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

338 2.26
RFQ
10-2513-10

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
14-3518-101

14-3518-101

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

138 5.13
RFQ
14-3518-101

Datasheet

518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
08-2503-30

08-2503-30

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

121 5.45
RFQ
08-2503-30

Datasheet

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
05-0518-00

05-0518-00

CONN SOCKET SIP 5POS GOLD

Aries Electronics

885 1.20
RFQ
05-0518-00

Datasheet

518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0518-10

02-0518-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

12,441 0.34
RFQ
02-0518-10

Datasheet

518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
12-8473-310C

12-8473-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

165 10.22
RFQ
12-8473-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
48-6554-11

48-6554-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2,063 32.61
RFQ
48-6554-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
441-PRS21001-12

441-PRS21001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,447 164.97
RFQ
441-PRS21001-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
08-3518-10T

08-3518-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

579 0.85
RFQ
08-3518-10T

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
06-0518-10

06-0518-10

CONN SOCKET SIP 6POS GOLD

Aries Electronics

717 1.00
RFQ
06-0518-10

Datasheet

518 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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