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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
2485264-3

2485264-3

DIP IC SOCKET 16P,SN

TE Connectivity AMP Connectors

6,519 0.00
RFQ
2485264-3

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2445893-3

2445893-3

DIP IC SOCKET 20P SMT

TE Connectivity AMP Connectors

3,000 0.00
RFQ
2445893-3

Datasheet

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2485264-4

2485264-4

DIP IC SOCKET 18P,GOLD FLASH

TE Connectivity AMP Connectors

5,280 0.00
RFQ
2485264-4

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2445893-2

2445893-2

DIP IC SOCKET 16P SMT

TE Connectivity AMP Connectors

3,000 0.00
RFQ
2445893-2

Datasheet

- Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 0.100" (2.54mm) Tin 196.9µin (5.00µm) Copper Alloy Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2485264-7

2485264-7

DIP IC SOCKET 28P,GOLD FLASH

TE Connectivity AMP Connectors

3,822 0.00
RFQ
2485264-7

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
2485265-1

2485265-1

DIP IC SOCKET 40P,GOLD FLASH

TE Connectivity AMP Connectors

1,950 0.00
RFQ
2485265-1

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
1-2397198-1

1-2397198-1

SOCKET 4710 FOR ODM

TE Connectivity AMP Connectors

3,512 0.00
RFQ

-

- Tray Active LGA 4710 0.031" (0.80mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount - Solder 0.031" (0.80mm) Tin - Copper Alloy Thermoplastic -40°C ~ 100°C
1674770-7

1674770-7

HARD TRAY ASSY MPGA479M W/TAPE

TE Connectivity AMP Connectors

6,240 0.00
RFQ
1674770-7

Datasheet

- Bulk Active PGA, ZIF (ZIP) 479 (26 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
1-390263-1

1-390263-1

CONN IC DIP SOCKET 28POS TIN

TE Connectivity AMP Connectors

1,199 0.36
RFQ
1-390263-1

Datasheet

- Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
2-641296-4

2-641296-4

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

2,459 0.35
RFQ
2-641296-4

Datasheet

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
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