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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































TE Connectivity AMP Connectors
全部重置
应用所有
结果: 702
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
2485264-1

2485264-1

DIP IC SOCKET 8P,GOLD FLASH

TE Connectivity AMP Connectors

4,766 0.00
RFQ
2485264-1

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 0.100" (2.54mm) Gold Flash Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Copper Alloy Thermoplastic -55°C ~ 125°C
1-2199299-5

1-2199299-5

40P,DIP SKT,600 CL,LDR,PB FREE

TE Connectivity AMP Connectors

2,339 1.18
RFQ
1-2199299-5

Datasheet

Diplomate DL Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Nickel Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
2041549-1

2041549-1

SOCKET ASSY, DMD 350, T/R, G/F

TE Connectivity AMP Connectors

442 9.56
RFQ
2041549-1

Datasheet

DMD Tape & Reel (TR) Active PGA, ZIF (ZIP) 350 (35 x 36) 0.050" (1.27mm) Gold Flash Copper Alloy Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead - Copper Alloy Liquid Crystal Polymer (LCP), Glass Filled -55°C ~ 105°C
1-2324271-3

1-2324271-3

RIGHT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

4,159 29.22
RFQ
1-2324271-3

Datasheet

- Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
1-2324271-2

1-2324271-2

LEFT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

3,756 29.22
RFQ
1-2324271-2

Datasheet

- Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -25°C ~ 100°C
1-2324271-1

1-2324271-1

RIGHT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

215 29.22
RFQ
1-2324271-1

Datasheet

- Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -25°C ~ 100°C
2350616-1

2350616-1

DUAL LGA,250 POS, DMD SOCKET

TE Connectivity AMP Connectors

296 13.94
RFQ
2350616-1

Datasheet

- Tray Active LGA 250 (16 x 25) 0.039" (1.00mm) Gold 3.00µin (0.076µm) Copper Alloy Surface Mount Board Guide, Open Frame Solder - - - - Thermoplastic -25°C ~ 100°C
1-2324271-4

1-2324271-4

LEFT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

121 29.22
RFQ
1-2324271-4

Datasheet

- Tray Active LGA 4189 2092 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034" (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic -25°C ~ 100°C
2-2129710-5

2-2129710-5

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

171 35.76
RFQ
2-2129710-5

Datasheet

- Tray Last Time Buy LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
2-2129710-6

2-2129710-6

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

249 35.88
RFQ
2-2129710-6

Datasheet

- Tray Last Time Buy LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic -
Total 702 Record«Prev12345...71Next»
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