Chuangxin Cloud - IC Sockets - Sockets for ICs, Transistors | Page 1 | Genuine Components, Fast Shipping

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
1-2199298-2 CONN IC DIP SOCKET 8POS TIN TE Connectivity AMP Connectors	9,722	0.28	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199298-1 CONN IC DIP SOCKET 6POS TIN TE Connectivity AMP Connectors	6,487	0.26	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	6 (2 x 3)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199298-3 CONN IC DIP SOCKET 14POS TIN TE Connectivity AMP Connectors	8,658	0.28	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199298-4 CONN IC DIP SOCKET 16POS TIN TE Connectivity AMP Connectors	3,880	0.32	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199298-5 CONN IC DIP SOCKET 18POS TIN TE Connectivity AMP Connectors	2,498	0.39	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	18 (2 x 9)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199298-6 CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors	2,473	0.59	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199298-8 CONN IC DIP SOCKET 24POS TIN TE Connectivity AMP Connectors	1,238	0.78	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199299-2 28P,DIP SKT,600 CL,LDR,PB FREE TE Connectivity AMP Connectors	3,376	0.88	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Nickel	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199298-9 CONN IC DIP SOCKET 28POS TIN TE Connectivity AMP Connectors	2,752	0.88	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
1-2199300-2 CONN IC DIP SOCKET 32POS TINLEAD TE Connectivity AMP Connectors	3,112	0.99	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin-Lead	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame, No Center Bar	Solder	0.100" (2.54mm)	Tin-Lead	60.0µin (1.52µm)	Brass, Copper	Polyester	-55°C ~ 125°C

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