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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
3-1571586-6

3-1571586-6

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

3,808 4.36
RFQ
3-1571586-6

Datasheet

800 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
8059-2G1

8059-2G1

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

2,176 11.04
RFQ
8059-2G1

Datasheet

8059 Bulk Obsolete Transistor, TO-5 3 (Round) - Gold - Copper Alloy Through Hole - Solder - Gold - Copper Alloy Polyamide (PA), Nylon -55°C ~ 125°C
822064-4

822064-4

CONN SOCKET PQFP 100POS TIN-LEAD

TE Connectivity AMP Connectors

1,406 6.41
RFQ
822064-4

Datasheet

- Tube Obsolete QFP 100 (4 x 25) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
2134928-1

2134928-1

CONN SOCKET LGA 1150POS GOLD

TE Connectivity AMP Connectors

3,543 2.81
RFQ
2134928-1

Datasheet

- Tray Active LGA 1150 0.036" (0.91mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame Solder 0.036" (0.91mm) - - - Thermoplastic -
8080-1G1

8080-1G1

CONN TRANSIST TO-3 4POS GOLD

TE Connectivity AMP Connectors

183 15.32
RFQ
8080-1G1

Datasheet

8080 Bulk Obsolete Transistor, TO-3 4 (Round) - Tin-Lead - Beryllium Copper Through Hole Closed Frame Solder - Tin-Lead - Beryllium Copper Fluoropolymer (FP) -55°C ~ 125°C
6-6437504-2

6-6437504-2

CONN TRANSIST TO-3 3POS SILVER

TE Connectivity AMP Connectors

2,411 7.56
RFQ
6-6437504-2

Datasheet

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver - Beryllium Copper Chassis Mount Closed Frame Solder - Silver - Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
8080-1G15

8080-1G15

CONN TRANSIST TO-3 3POS TIN-LEAD

TE Connectivity AMP Connectors

1,148 16.28
RFQ
8080-1G15

Datasheet

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead 200.0µin (5.08µm) Beryllium Copper Fluoropolymer (FP) -55°C ~ 125°C
8080-1G24

8080-1G24

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

380 16.33
RFQ
8080-1G24

Datasheet

- Bulk Obsolete Transistor, TO-3 3 (Round) - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin-Lead 20.0µin (0.51µm) Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
2013620-3

2013620-3

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors

1,952 13.93
RFQ
2013620-3

Datasheet

- Tape & Reel (TR) Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) - - Copper Alloy Thermoplastic -
9-1437504-0

9-1437504-0

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

4,084 6.36
RFQ
9-1437504-0

Datasheet

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
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