Chuangxin Cloud - IC Sockets - Sockets for ICs, Transistors | Page 11 | Genuine Components, Fast Shipping

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
2-1571586-4 CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors	2,198	6.45	RFQ	Datasheet	800	Bulk	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C
2-1571551-9 CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors	3,445	3.15	RFQ	Datasheet	500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	Flash	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	Flash	Nickel	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 125°C
524-AG11D-ESL CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	259	0.00	RFQ	Datasheet	500	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	5.00µin (0.127µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	-	-	Brass	-	-55°C ~ 125°C
1-1825376-3 CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors	3,612	2.69	RFQ	Datasheet	Diplomate DL	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Thermoplastic, Glass Filled	-55°C ~ 125°C
808-AG10D CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors	3,107	0.00	RFQ	Datasheet	800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	5.00µin (0.127µm)	Copper Alloy	Polyester	-55°C ~ 105°C
820-AG11D CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors	3,633	0.00	RFQ	Datasheet	800	Tube	Obsolete	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin-Lead	-	Copper Alloy	Polyester	-55°C ~ 105°C
6-1437537-6 6-1437537-6 TE Connectivity AMP Connectors	9,007	0.00	RFQ	Datasheet	*	Box	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
2134928-2 CONN SOCKET LGA 1150POS GOLD TE Connectivity AMP Connectors	3,847	23.10	RFQ	Datasheet	-	Bulk	Obsolete	LGA	1150	0.036" (0.91mm)	Gold	3.90µin (0.099µm)	Copper Alloy	Surface Mount	Closed Frame	Solder	0.036" (0.91mm)	-	-	-	Thermoplastic	-
1-1814655-3 CONN SOCKET SIP 20POS GOLD TE Connectivity AMP Connectors	3,335	4.05	RFQ	Datasheet	-	Bulk	Obsolete	SIP	20 (1 x 20)	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100" (2.54mm)	Gold	29.5µin (0.75µm)	Brass	Thermoplastic, Polyester	-55°C ~ 125°C
2-1571586-8 CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors	1,665	4.02	RFQ	Datasheet	800	Tube	Obsolete	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Gold	25.0µin (0.63µm)	Copper	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester	-55°C ~ 105°C

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