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the component supply chain has continued to experience price increases

3/7/2026 1:06:02 AM

Since the beginning of the year, the component supply chain has continued to experience price increases, affecting both upstream and downstream sectors, with frequent announcements of price adjustments from manufacturers. Recently, two major manufacturers, Texas Instruments (TI) and NXP, have reportedly issued notifications stating that they will adjust their prices starting April 1. This, combined with previous price adjustments from companies like ADI and Infineon, is expected to significantly impact the cost structure of the electronics industry in 2026.


Below is a compiled summary of price adjustment information from manufacturers across key sectors since the beginning of the year, for your reference.

                                                                                     


Company
Product Category
Price Increase Range
Effective Date
Infineon
Power Switches & Related Chips
Undisclosed
April 1, 2026
Vishay
MOSFET & IC Product Lines
Undisclosed
February 12, 2026
ROHM
Some Semiconductor Products
Undisclosed
March 1, 2026
Alpha & Omega Semiconductor (AOS)
Products Directly Affected by Manufacturing Cost Increases & Sustained Capacity Investment
Undisclosed
April 1, 2026
CR Micro
Full Range of Microelectronic Products
From 10%
February 1, 2026
Lansus Technology
Small-Signal Diodes/Triodes, MOS-Type Chips
10%
March 1, 2026
Hongwei Technology
IGBT Single Tubes/Modules, MOSFET Devices
Around 10%
March 1, 2026
A-Power
MOSFET Products
From 10%
March 1, 2026
JieJie Microelectronics
MOS Series Products
10% - 20%
February 1, 2026

Passive Components

Company
Product Category
Price Increase Range
Effective Date
Panasonic
30 - 40 Tantalum Capacitor Products
15% - 30%
February 1, 2025
YAGEO
Medium-High Voltage, High-Capacitance, Automotive-Grade MLCCs, Thick Film Resistors
10% - 20%
December 1, 2025
YAGEO
Some Consumer-Grade Resistors
15% - 20%
February 1, 2026
Prisemi (YAGEO's Subsidiary)
Some Ferrite Beads
Undisclosed
January 1, 2026
Kemet (YAGEO's Subsidiary)
Low-Voltage Small-Medium Tantalum Capacitors
10% - 15%
June 1, 2025
Kemet (YAGEO's Subsidiary)
High-End Tantalum Capacitors (T520, T521, T530 Series)
20% - 30%
November 1, 2025
Kemet (YAGEO's Subsidiary)
Polymer Tantalum Capacitors (T523 Series)
Undisclosed, Expected Double-Digit
April 1, 2026
Walsin Technology
Resistor Products (Full Range from 0201 to 1206)
Undisclosed
February 1, 2026
UniOhm
Resistor Products (0402 to 1206)
15% - 20%
Aligns with YAGEO
Fenghua Advanced Technology

Inductive Beads (1608 2012, 3216, ~16 Models,: 5% - 25%),Varistors (Silver-Electrode Full Series: 10% - 20%),

Ceramic Capacitors (Silver-Electrode Full Series: 10% - 20%),Thick Film Circuits (Full Series: 15% - 30%)

Composite: 5% - 30%
November 17, 2025
Fenghua Advanced Technology
Resistor Products
Undisclosed
January 1, 2026 (Onward)
Sunlord Technology
Stacked Inductive Beads, Power Inductors, Automotive Beads, etc.
Market-Driven
January 1, 2026 (Onward)
FuJie Electronics
Partial Products of Thick Film Chip Resistors (All Series)
8% - 20%
December 24, 2025
Xuanlong Technology
Thick Film Chip Resistors (All Series)
10% - 20%
December 25, 2025
HKT Technology
Thick Film Resistors & Semiconductor Device Products
8% - 20%; 5% - 20%
December 25, 2025
Hongfa Electromechanical Sound
Partial Products (Company Mainly Operates Relays, Connectors, Capacitors, etc.)
5% - 15%
December 15, 2025




Panorama of the Price Increase Wave


Looking at the essence through the price dynamics, this round of price increases is a supply chain value redistribution dominated by AI, driven by multiple factors.
  1. Material Foundation: The "Cost Floor" of Upstream Resources Has Risen Overall
    The core material drivers of this price surge are key precious metals and basic raw materials such as copper, silver, gold, and tin. Since 2025, the prices of these materials have continued to hit record highs. For example, domestic copper prices exceeded 100,000 RMB per ton, a year-over-year increase of over 35%. Silver prices soared from about 5,900 RMB per kilogram to 18,000 RMB per kilogram, a rise of over 200%.
    Whether it's connectors requiring large amounts of copper, MLCCs dependent on silver paste, or power devices with high packaging costs, the production costs of all have been pushed up by the rise in these material prices, forming a "cost floor" that the entire industry chain must confront.
  2. Change Engine: The "Technology Engine" of AI Demand Provides Core Momentum
    If rising raw material costs are the push, then AI is the pull and engine driving structural change. AI servers have a massive demand pull for components. Their MLCC usage is several to ten times that of ordinary servers, and their demand for high-power MOSFETs and IGBTs is also several times higher. Not only is the demand large, but it also demands high performance and reliability. This directly drives demand for advanced products like high-end MLCCs, high-K (high dielectric constant) materials, low-DK (low dielectric constant) glass fiber cloth, and HBM memory.
    In pursuit of AI's high profitability, wafer foundries are shifting capacity to advanced processes, and manufacturers are reallocating production lines to high-end products. This resource tilt directly squeezes capacity for mature processes (e.g., 8-inch wafers) and standard products (e.g., traditional electronic cloth), creating supply tension across all product categories, from high-end to low-end. This is the fundamental logic of how the AI engine, by "siphoning" capacity, ignites price increases across the entire chain.
  3. Phenomenal Form: Full Industry Chain Transmission and Structural Divergence
    Under the influence of materials and momentum, the price increases manifest in unique and complex forms. The surge does not remain confined to a single link. It rapidly transmits from the most upstream metals and glass fiber cloth to chip design (e.g., analog chips, MCUs), wafer foundry, packaging and testing, then to passive components (MLCCs, resistors, tantalum capacitors), connectors, and finally affects downstream PCBs and end-product assembly.
    Under the influence of multiple factors, this price increase wave is not uniform but highly divergent. Products strongly tied to AI and automotive electronics are in short supply, have strong pricing power, and see the highest price hikes. General-purpose products in the consumer electronics sector, while under cost pressure, face weak demand recovery, resulting in weak price pass-through or even losses.
  4. Operating Objective: Value Shifts Toward Links with "Technology Pricing Power"
    This is the objective and outcome of the entire price surge's evolution, and it is key to understanding the future landscape of the industry chain.
    Those controlling scarce resources gain "value fortresses." Enterprises possessing upstream core materials and technologies, due to the irreplaceability of their products, become the most direct and certain beneficiaries, firmly locking in profits.
    Those with core technology gain "pricing power." Enterprises mastering high-end MLCCs, advanced process technologies, and high-performance power chip design capabilities gain the power to shift from "price takers" to "price makers" because their products are essential for AI infrastructure. Value is converging towards these technological highlands at an unprecedented speed.
    Manufacturing links lacking barriers become "cost troughs." Companies in the mid-to-low end, reliant on cost competition, are seeing their value diluted. They suffer the squeeze from upstream price increases while being unable to effectively pass costs downstream, becoming the disadvantaged parties in the value chain.
    Ultimately, cost pressures will be passed on to consumers through end products, but the links that define technology have already secured their profits in advance.







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