• MCU Giant National Technology Raises Prices
  National Technology issued a price adjustment notice stating that due to continuous sharp increases in core raw material costs such as wafers and packaging materials, the company has decided to raise prices for some products by 15%–20% starting April 7, 2026, after careful evaluation.
• Memory Giants Shift to 3–5 Year Long - Term Supply Agreements
  Reports indicate that Samsung Electronics and SK Hynix are abandoning one - year short - term contracts with global large - scale tech companies and instead adopting a pure long - term supply agreement model lasting three to five years. Samsung Electronics has stipulated that all new contracts signed with major customers from this year will be at least three - year long - term agreements. SK Hynix is currently in talks with Google on a five - year general DRAM long - term supply contract.
• Infineon and Jita Semiconductor Reach Cooperation Agreement
  Jita Semiconductor and Infineon officially signed a project cooperation agreement on April 7, 2026. The two sides will deepen technical cooperation in the field of embedded non - volatile storage (eNVM) and jointly promote the upgrading of characteristic process foundry capabilities. Jita Semiconductor introduced Infineon's SONOS technology, further enriching its solutions for high - reliability and cost - sensitive scenarios.
• Intel Announces Joining Terafab Advanced Wafer Fab Project
  Reports show that Intel announced it would join Elon Musk's giant wafer fab Terafab project together with Tesla, SpaceX, and xAI. Terafab is located in Austin, Texas, USA, and is positioned as the world's largest 2nm chip factory, realizing the integrated layout of logic chips, memory chips, and advanced packaging throughout the entire chain. Its core outputs include edge reasoning chips for Tesla's FSD autonomous driving and Optimus humanoid robots, and another type is special chips tailored for space scenarios.
• SK Hynix's New Plant M15X Expands Mass Production Scale of Most Advanced DRAM
  Reports indicate that SK Hynix will soon officially expand the mass production scale of its most advanced DRAM at its new plant M15X in Cheongju, South Korea. Most of the DRAM produced by M15X will be used for high - revenue products, including the sixth - generation HBM (HBM4), and part of it will also be used for server - class high - performance DRAM. The industry predicts that M15X will become SK Hynix's core stronghold for continuously expanding HBM production before 2027.
• Report: Samsung Plans to Invest $4 Billion in Building a Chip Packaging Plant in Vietnam
  Reports show that Samsung Electronics plans to build a new chip packaging plant in northern Vietnam with a total investment of up to $4 billion, further strengthening its strategic layout in Vietnam. The project will be advanced in phases, with the initial investment scale being $2 billion. Driven by the global AI wave, the demand for chips from data centers and AI terminal devices continues to rise, and Samsung and its peers are accelerating capacity expansion to cope with this trend.
• Samsung and SK Hynix Sign Long - Term Ammonia Procurement Contracts Separately
  Reports indicate that Samsung Electronics and SK Hynix have separately signed long - term additional supply contracts with Germany's Linde and Air Products in the United States to address the shortage of ammonia supply. Among th, Linde purchases ammonemia raw materials in the United States and refines and processes them, thus entering the semiconductor supply chain.

Application - End Dynamics

• Samsung Promotes Major Strategic Transformation of China Market Business
  Reports show that Samsung Electronics is undergoing a major strategic adjustment in the Chinese market, with the core being a transformation from the consumer electronics business to the semiconductor business. According to the rumored plan, after the adjustment, Samsung China will only retain the complete organization of the two core businesses of mobile phones and storage. Other business segments, including white goods (refrigerators, washing machines, etc.), black goods (TVs), and displays, will face integration or withdrawal.
• Report: Apple Books 60,000 Wafer Capacities from TSMC
  Morgan Stanley analyst's latest research report points out that Apple has greatly expanded its capacity booking for TSMC's SoIC (System on Integrated Chips) packaging. It booked 36,000 wafers in 2026 and will increase to 60,000 wafers in 2027. In Apple's current booking round, part of the capacity will be used for M5 Pro, M5 Max, and the M6 Pro/Max chips to be launched next year, but most of the capacity will serve the AI server chip codenamed Baltral.

Data & Outlook

• Omida: In the first quarter of 2026, the total shipments of desktops, notebooks, and workstations increased by 3.2% year - on - year to 64.8 million units. Among them, notebook (including mobile workstation) shipments increased slightly by 2.6% year - on - year to 50.8 million units; desktop (including desktop workstation) performed slightly better, with a year - on - year growth of 5.4%, reaching 14 million units.
• IDC: In the first quarter of 2026, global PC shipments increased by 2.5% year - on - year to 65.6 million units. Although the macro - economic environment continued to deteriorate and the supply of memory chips was tight, the PC market still delivered another quarter of steady growth. The growth was mainly driven by three factors: the market's expectation of rising component prices, the demand for migrating from Windows 10, and major manufacturers' intensive launch of new products.
• Counterpoint Research: The cumulative shipments of physical AI devices between 2025 and 2035 will reach 145 million units, among which drones contribute 59 million, robots 48 million, and autonomous vehicles 38 million. The humanoid robot sub - market will become the fastest - growing sub - category in the physical AI field: the cumulative installed base in 2028 will exceed 100,000 units, a 7 - fold increase from 2025.