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NXP USA Inc. MC33FS6502LAER2

Part No.:
MC33FS6502LAER2
Manufacturer:
NXP USA Inc.
Category:
Power Management - Specialized
Package:
48-LQFP Exposed Pad
Datasheet:
Chuangxin CloudMC33FS6502LAER2.pdf
Description:
SYSTEM BASIS CHIP DCDC 0.8A VCO
Quantity:
Payment:
Payment
Shipping:
Shipping

Product details

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Product attributes
Attribute value
Manufacturer:
NXP USA Inc.
Series:
-
Package/Case:
48-LQFP Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
System Basis Chip
Current - Supply:
-
Voltage - Supply:
1V ~ 5V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-HLQFP (7x7)
Datasheet:
Chuangxin CloudMC33FS6502LAER2.pdf

Inventory:1,153

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