Welcome to Chuangxin Cloud!

Canfield Technologies RCBLF227L2062E

Part No.:
RCBLF227L2062E
Manufacturer:
Canfield Technologies
Category:
Solder
Package:
Description:
BLF227 ROSIN FLUX 8 OZ .062 DIA.
Quantity:
Payment:
Payment
Shipping:
Shipping

Product details

  • Specifications
  • FAQ
  • Comparison
  • Tags
Product attributes
Attribute value
Manufacturer:
Canfield Technologies
Series:
-
Packaging:
Spool
Product Status:
Active
Type:
Wire Solder
Composition:
BLF 227 (99.17Sn/.8Cu/.03Ni)
Diameter:
0.062" (1.57mm)
Melting Point:
440°F (227°C)
Flux Type:
Rosin Activated (RA)
Wire Gauge:
14 AWG, 16 SWG
Mesh Type:
-
Process:
Lead Free
Form:
Spool, 8 oz (227g), 1/2 lb
Shelf Life:
24 Months
Shelf Life Start:
Date of Manufacture
Storage/Refrigeration Temperature:
50°F ~ 104°F (10°C ~ 40°C)

Inventory:4,203

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company*
Email*
Comments
SMDSWLF.020 1OZ
SMDSWLF.020 1OZ

Chip Quik Inc.

SMDIN52SN48
SMDIN52SN48

Chip Quik Inc.

BARSN99.3CU0.7-8OZ
BARSN99.3CU0.7-8OZ

Chip Quik Inc.

4902P-25G
4902P-25G

MG Chemicals

BARSN63PB37
BARSN63PB37

Chip Quik Inc.

70-1607-0520
70-1607-0520

Kester Solder

One-stop procurement solution
One-stop procurement solution
Cost down and save your time
Cost down and save your time
Reliable package and fast delivery
Reliable package and fast delivery
365 days after-sales service and warranty
365 days after-sales service and warranty
Chuangxin Cloud

HOME

Chuangxin Cloud

PRODUCT

Chuangxin Cloud

E-mail

Chuangxin Cloud

USER

Tipsχ