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Chip Quik Inc. IPC0192-S

Part No.:
IPC0192-S
Manufacturer:
Chip Quik Inc.
Category:
Solder Stencils, Templates
Package:
Datasheet:
Chuangxin CloudIPC0192-S.pdf
Description:
QFN-36/LFCSP-36 (5 CENTER PADS)
Quantity:
Payment:
Payment
Shipping:
Shipping

Product details

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Product attributes
Attribute value
Manufacturer:
Chip Quik Inc.
Series:
Proto-Advantage IPC
Packaging:
Bulk
Product Status:
Active
Type:
QFN/LFCSP
Number of Positions:
36
Pitch:
0.035" (0.90mm)
Outer Dimension:
1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension:
0.433" L x 0.354" W (11.00mm x 9.00mm)
Thermal Center Pad:
0.122" L x 0.087" W (3.10mm x 2.20mm)
Material:
Stainless Steel
Datasheet:
Chuangxin CloudIPC0192-S.pdf

Inventory:4,163

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Part Number
Quantity*
Price
Name*
Company*
Email*
Comments
PA0034-S
PA0034-S

Chip Quik Inc.

PA0020-S
PA0020-S

Chip Quik Inc.

IPC0020-S
IPC0020-S

Chip Quik Inc.

IPC0014-S
IPC0014-S

Chip Quik Inc.

PA0001-S
PA0001-S

Chip Quik Inc.

IPC0006-S
IPC0006-S

Chip Quik Inc.

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