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制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





























































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
TS391LT50

TS391LT50

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

2,074 21.95
RFQ
TS391LT50

Datasheet

- Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Jar, 1.76 oz (50g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMDLTLFP10

SMDLTLFP10

SOLDER PASTE LOW TEMP 10CC W/TIP

Chip Quik Inc.

4,121 21.95
RFQ
SMDLTLFP10

Datasheet

- Dispenser Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 3 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD291AXT5

SMD291AXT5

SOLDER PASTE NO CLEAN 63SN/37PB

Chip Quik Inc.

4,965 21.99
RFQ
SMD291AXT5

Datasheet

SMD2 Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 5 Leaded Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
EXB-SN63PB37

EXB-SN63PB37

SOLDER BAR SN63/PB37 1LB (454G)

Chip Quik Inc.

1,783 23.98
RFQ
EXB-SN63PB37

Datasheet

Super Low Dross™ Bulk Active Bar Solder Sn63Pb37 (63/37) - 361°F (183°C) - - - Leaded Bar, 1 lb (454g) - - -
SMD291SNL10

SMD291SNL10

SOLDER PASTE NO-CLEAN 10CC SYR

Chip Quik Inc.

3,894 24.99
RFQ
SMD291SNL10

Datasheet

- Dispenser Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean - 3 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
TS391LT10

TS391LT10

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

3,326 28.95
RFQ
TS391LT10

Datasheet

- Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 4 Lead Free Syringe, 1.23 oz (35g), 10cc 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMDIN66.3BI33.7

SMDIN66.3BI33.7

INDIUM/BISMUTH SOLDER WIRE (IN66

Chip Quik Inc.

2,182 0.00
RFQ
SMDIN66.3BI33.7

Datasheet

CHIPQUIK® Bulk Active Wire Solder In66.3Bi33.7 (66.3/33.7) 0.031" (0.79mm) 162°F (72°C) - - - Lead Free Spool 60 Months Date of Manufacture -
SMDSWLF.031 4OZ

SMDSWLF.031 4OZ

SLD WIRE NO-CLEAN 96.5/3/.5 4OZ.

Chip Quik Inc.

4,721 31.30
RFQ
SMDSWLF.031 4OZ

Datasheet

- Spool Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble 20 AWG, 22 SWG - Lead Free Spool, 4 oz (113.40g) - - -
SMDLTLFP10T5

SMDLTLFP10T5

SOLDER PASTE LOW TEMP LF T5 10CC

Chip Quik Inc.

2,185 32.95
RFQ
SMDLTLFP10T5

Datasheet

- Dispenser Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 281°F (138°C) No-Clean - 5 Lead Free Syringe, 1.23 oz (35g), 10cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMDSWLTLFP32

SMDSWLTLFP32

SOLDER WIRE LOW TEMP 42/57/1 32'

Chip Quik Inc.

3,296 38.31
RFQ
SMDSWLTLFP32

Datasheet

- Bulk Active Wire Solder Bi57Sn42Ag1 (57/42/1) 0.030" (0.76mm) 280°F (138°C) - 21 AWG, 22 SWG - Lead Free - - - -
Total 486 Record«Prev1234567...49Next»
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