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制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





























































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
NCSWLF.031 0.5OZ

NCSWLF.031 0.5OZ

LF SOLDER WIRE MINI POCKET PACK

Chip Quik Inc.

298 4.67
RFQ
NCSWLF.031 0.5OZ

Datasheet

- Bulk Active Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.031" (0.79mm) 423 ~ 428°F (217 ~ 220°C) No-Clean 20 AWG, 21 SWG - - Tube, 0.50 oz (14.17g) - - -
SMD291AX250T4

SMD291AX250T4

SLDR PST NO-CLEAN 63/37 T4 250G

Chip Quik Inc.

4,606 50.95
RFQ
SMD291AX250T4

Datasheet

- Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Jar, 8.8 oz (250g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD2165

SMD2165

SOLDER SPHERES 63/37 .012 DIAM

Chip Quik Inc.

2,442 102.95
RFQ
SMD2165

Datasheet

SMD2 Bulk Active Solder Sphere Sn63Pb37 (63/37) 0.012" (0.31mm) 361°F (183°C) - - - Leaded Jar 24 Months Date of Manufacture -
WW100GE.031 1LB

WW100GE.031 1LB

GERMANIUM DOPED SOLDER WIRE SN/C

Chip Quik Inc.

2,378 0.00
RFQ

-

CHIPQUIK® Bulk Active Wire Solder Sn99.244Cu0.7 (Ni0.05/Ge0.006) 0.031" (0.79mm) 441°F (227°C) No-Clean, Water Soluble - - Lead Free Spool, 1 lb (454 g) 60 Months Date of Manufacture -
EXB-SN96.5AG3.5

EXB-SN96.5AG3.5

SOLDER BAR SN96.5/AG3.5 1LB (454

Chip Quik Inc.

2,442 0.00
RFQ
EXB-SN96.5AG3.5

Datasheet

CHIPQUIK® Bulk Active Bar Solder Sn96.5Ag3.5 (96.5/3.5) - 430°F (221°C) - - - Leaded Bar, 1 lb (453.59g) - - -
WW100GE.020 1LB

WW100GE.020 1LB

GERMANIUM DOPED SOLDER WIRE SN/C

Chip Quik Inc.

3,149 0.00
RFQ
WW100GE.020 1LB

Datasheet

CHIPQUIK® Bulk Active Wire Solder Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006) 0.020" (0.51mm) 441°F (227°C) No-Clean - - - Spool 60 Months - -
NC191LT10

NC191LT10

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.

4,678 7.95
RFQ
NC191LT10

Datasheet

Smooth Flow™ Bulk Active Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) - 280°F (138°C) No-Clean - 4 Lead Free Syringe, 0.35 oz (10g), 5cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
NC191LTA10

NC191LTA10

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.

3,540 7.95
RFQ
NC191LTA10

Datasheet

Smooth Flow™ Bulk Active Solder Paste Bi57Sn42Ag1 (57/42/1) - 279°F (137°C) No-Clean - 4 - Syringe, 0.35 oz (10g), 3cc 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
EXB-SN63PB37-0.5LB

EXB-SN63PB37-0.5LB

SOLDER BAR SN63/PB37 0.5LB (227G

Chip Quik Inc.

4,144 12.60
RFQ
EXB-SN63PB37-0.5LB

Datasheet

Super Low Dross™ Bulk Active Bar Solder Sn63Pb37 (63/37) - 361°F (183°C) - - - Leaded Bar, 0.5 lb (227g) - - -
SMD291AX

SMD291AX

SOLDER PASTE NO-CLEAN 63/37 5CC

Chip Quik Inc.

3,871 14.99
RFQ
SMD291AX

Datasheet

- Dispenser Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 3 Leaded Syringe, 0.53 oz (15g), 5cc 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
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