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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1836-G-H

APH-1836-G-H

APH-1836-G-H

Samtec Inc.

4,636 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1536-G-H

APH-1536-G-H

APH-1536-G-H

Samtec Inc.

4,222 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0636-G-H

APH-0636-G-H

APH-0636-G-H

Samtec Inc.

2,201 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
255-7322-01-0602

255-7322-01-0602

3M TEXTOOL ZIP STRIP SOCKETS 255

3M

1,343 0.00
RFQ

-

Textool™ Box Obsolete - - - - - - - - - - - - - - -
255-7322-02-0602

255-7322-02-0602

3M TEXTOOL ZIP STRIP SOCKETS 255

3M

3,110 0.00
RFQ

-

Textool™ Box Obsolete - - - - - - - - - - - - - - -
514-87-388M26-001148

514-87-388M26-001148

CONN SOCKET BGA 388POS GOLD

Preci-Dip

2,520 34.00
RFQ
514-87-388M26-001148

Datasheet

514 Bulk Active BGA 388 (26 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-279-19-081112

614-83-279-19-081112

CONN SOCKET PGA 279POS GOLD

Preci-Dip

2,273 36.17
RFQ
614-83-279-19-081112

Datasheet

614 Bulk Active PGA 279 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-320-19-131147

546-83-320-19-131147

CONN SOCKET PGA 320POS GOLD

Preci-Dip

2,804 34.93
RFQ
546-83-320-19-131147

Datasheet

546 Bulk Active PGA 320 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
614-83-281-19-001112

614-83-281-19-001112

CONN SOCKET PGA 281POS GOLD

Preci-Dip

2,201 36.43
RFQ
614-83-281-19-001112

Datasheet

614 Bulk Active PGA 281 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
APH-0538-G-T

APH-0538-G-T

APH-0538-G-T

Samtec Inc.

1,594 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1238-G-T

APH-1238-G-T

APH-1238-G-T

Samtec Inc.

4,366 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0838-G-T

APH-0838-G-T

APH-0838-G-T

Samtec Inc.

4,049 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1638-G-T

APH-1638-G-T

APH-1638-G-T

Samtec Inc.

2,150 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
546-83-321-19-121147

546-83-321-19-121147

CONN SOCKET PGA 321POS GOLD

Preci-Dip

1,602 35.04
RFQ
546-83-321-19-121147

Datasheet

546 Bulk Active PGA 321 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-255M16-001104

558-10-255M16-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

4,559 30.96
RFQ
558-10-255M16-001104

Datasheet

558 Bulk Active BGA 255 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-256M16-000104

558-10-256M16-000104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

4,990 31.08
RFQ
558-10-256M16-000104

Datasheet

558 Bulk Active BGA 256 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-256M20-001104

558-10-256M20-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

2,273 31.80
RFQ
558-10-256M20-001104

Datasheet

558 Bulk Active BGA 256 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
518-77-255M16-001105

518-77-255M16-001105

CONN SOCKET PGA 255POS GOLD

Preci-Dip

3,396 31.09
RFQ
518-77-255M16-001105

Datasheet

518 Bulk Active PGA 255 (16 x 16) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
558-10-272M20-001101

558-10-272M20-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

1,160 31.82
RFQ
558-10-272M20-001101

Datasheet

558 Bulk Active PGA 272 (20 x 20) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
550-80-381-18-101135

550-80-381-18-101135

PGA SOLDER TAIL

Preci-Dip

2,613 34.72
RFQ
550-80-381-18-101135

Datasheet

550 Bulk Active PGA 381 (18 x 18) 0.050" (1.27mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
Total 19086 Record«Prev1... 872873874875876877878879...955Next»
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