Welcome to Chuangxin Cloud!

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
144-PGM13095-11

144-PGM13095-11

CONN SOCKET PGA GOLD

Aries Electronics

1,505 35.46
RFQ
144-PGM13095-11

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
28-3552-16

28-3552-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2,449 42.56
RFQ
28-3552-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
APH-0532-G-R

APH-0532-G-R

APH-0532-G-R

Samtec Inc.

2,731 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0932-G-R

APH-0932-G-R

APH-0932-G-R

Samtec Inc.

1,309 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0632-G-R

APH-0632-G-R

APH-0632-G-R

Samtec Inc.

1,352 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0332-G-R

APH-0332-G-R

APH-0332-G-R

Samtec Inc.

1,832 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1732-G-R

APH-1732-G-R

APH-1732-G-R

Samtec Inc.

4,107 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0832-G-R

APH-0832-G-R

APH-0832-G-R

Samtec Inc.

2,040 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
232-1270-01-0602

232-1270-01-0602

CONN SOCKET PGA ZIF 32POS GOLD

3M

4,877 0.00
RFQ
232-1270-01-0602

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
232-1270-02-0602

232-1270-02-0602

CONN SOCKET PGA ZIF 32POS GOLD

3M

1,266 0.00
RFQ
232-1270-02-0602

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
517-83-529-21-121111

517-83-529-21-121111

CONN SOCKET PGA 529POS GOLD

Preci-Dip

2,699 31.64
RFQ
517-83-529-21-121111

Datasheet

517 Bulk Active PGA 529 (21 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
232-1270-51-0602

232-1270-51-0602

STAGGERED ZIP STRIP POCKETS 32 C

3M

4,696 0.00
RFQ

-

Textool™ - Obsolete - - - - - - - - - - - - - - -
546-87-403-19-111147

546-87-403-19-111147

CONN SOCKET PGA 403POS GOLD

Preci-Dip

2,387 34.71
RFQ
546-87-403-19-111147

Datasheet

546 Bulk Active PGA 403 (19 x 19) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
510-93-223-18-095002

510-93-223-18-095002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,846 37.55
RFQ
510-93-223-18-095002

Datasheet

510 Tube Active PGA 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-13-121-11-000002

510-13-121-11-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,068 37.57
RFQ
510-13-121-11-000002

Datasheet

510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
510-13-121-11-000003

510-13-121-11-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,804 37.57
RFQ
510-13-121-11-000003

Datasheet

510 Bulk Active PGA 121 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-3572-16

24-3572-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2,817 30.26
RFQ
24-3572-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
116-43-964-61-001000

116-43-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,673 34.19
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-964-61-001000

116-93-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,915 34.19
RFQ

-

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
28-6556-41

28-6556-41

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,555 43.27
RFQ
28-6556-41

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
Total 19086 Record«Prev1... 868869870871872873874875...955Next»
One-stop procurement solution
One-stop procurement solution
Cost down and save your time
Cost down and save your time
Reliable package and fast delivery
Reliable package and fast delivery
365 days after-sales service and warranty
365 days after-sales service and warranty
Chuangxin Cloud

HOME

Chuangxin Cloud

PRODUCT

Chuangxin Cloud

E-mail

Chuangxin Cloud

USER