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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    32-6508-30

    32-6508-30

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,696 18.64
    RFQ
    		32-6508-30

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6823-90T

    32-6823-90T

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    		 1,567 18.64
    RFQ
    		32-6823-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    146-93-422-41-013000

    146-93-422-41-013000

    CONN IC DIP SOCKET 22POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,747 14.23
    RFQ
    		146-93-422-41-013000

    Datasheet

         		146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-43-422-41-013000

    146-43-422-41-013000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,036 14.23
    RFQ
    		146-43-422-41-013000

    Datasheet

         		146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-13-324-41-001000

    210-13-324-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,938 14.43
    RFQ
    		210-13-324-41-001000

    Datasheet

         		210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-13-624-41-001000

    210-13-624-41-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,582 14.43
    RFQ
    		210-13-624-41-001000

    Datasheet

         		210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-13-424-41-001000

    210-13-424-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,096 14.43
    RFQ
    		210-13-424-41-001000

    Datasheet

         		210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-41-322-11-480000

    605-41-322-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 4,737 14.86
    RFQ
    		605-41-322-11-480000

    Datasheet

         		605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-41-422-11-480000

    605-41-422-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 4,396 14.86
    RFQ
    		605-41-422-11-480000

    Datasheet

         		605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-322-11-480000

    605-91-322-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 2,771 14.86
    RFQ
    		605-91-322-11-480000

    Datasheet

         		605 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    605-91-422-11-480000

    605-91-422-11-480000

    SKT CARRIER LOWPRO

    Mill-Max Manufacturing Corp.

    		 3,665 14.86
    RFQ
    		605-91-422-11-480000

    Datasheet

         		605 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-320-G-N

    APA-320-G-N

    ADAPTER PLUG

    Samtec Inc.

    		 1,014 14.62
    RFQ
    		APA-320-G-N

    Datasheet

         		APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    346-93-159-41-013000

    346-93-159-41-013000

    CONN SOCKET SIP 59POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,075 10.80
    RFQ
    		346-93-159-41-013000

    Datasheet

         		346 Bulk Active SIP 59 (1 x 59) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-159-41-013000

    346-43-159-41-013000

    CONN SOCKET SIP 59POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,334 10.80
    RFQ
    		346-43-159-41-013000

    Datasheet

         		346 Bulk Active SIP 59 (1 x 59) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-146-31-018000

    714-43-146-31-018000

    CONN SOCKET SIP 46POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,443 11.89
    RFQ
    		714-43-146-31-018000

    Datasheet

         		714 Bulk Active SIP 46 (1 x 46) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-6556-10

    40-6556-10

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,216 15.47
    RFQ
    		40-6556-10

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    126-93-314-41-002000

    126-93-314-41-002000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,749 15.13
    RFQ
    		126-93-314-41-002000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-314-41-002000

    126-43-314-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,100 15.13
    RFQ
    		126-43-314-41-002000

    Datasheet

         		126 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-328-41-003000

    116-41-328-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,253 15.07
    RFQ
    		116-41-328-41-003000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-428-41-003000

    116-41-428-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,965 15.07
    RFQ
    		116-41-428-41-003000

    Datasheet

         		116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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