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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    110-93-428-41-105000

    110-93-428-41-105000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,342 14.85
    RFQ
    		110-93-428-41-105000

    Datasheet

         		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-628-41-105000

    110-93-628-41-105000

    CONN IC DIP SOCKET 28POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,419 14.85
    RFQ
    		110-93-628-41-105000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-428-41-105000

    110-43-428-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,068 14.85
    RFQ
    		110-43-428-41-105000

    Datasheet

         		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-628-41-105000

    110-43-628-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,085 14.85
    RFQ
    		110-43-628-41-105000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0922-T-R

    APH-0922-T-R

    APH-0922-T-R

    Samtec Inc.

    		 1,221 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1922-T-R

    APH-1922-T-R

    APH-1922-T-R

    Samtec Inc.

    		 1,852 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0222-T-R

    APH-0222-T-R

    APH-0222-T-R

    Samtec Inc.

    		 4,595 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1722-T-R

    APH-1722-T-R

    APH-1722-T-R

    Samtec Inc.

    		 4,420 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-93-316-41-008000

    116-93-316-41-008000

    CONN IC DIP SOCKET 16POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,316 14.52
    RFQ
    		116-93-316-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-316-41-008000

    116-43-316-41-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,321 14.52
    RFQ
    		116-43-316-41-008000

    Datasheet

         		116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-2020-T-22

    HLS-2020-T-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,658 0.00
    RFQ
    		HLS-2020-T-22

    Datasheet

         		HLS Bulk Active SIP 400 (20 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    111-47-650-41-001000

    111-47-650-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 3,328 14.79
    RFQ
    		111-47-650-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    317-43-119-41-005000

    317-43-119-41-005000

    CONN SKT STRIP

    Mill-Max Manufacturing Corp.

    		 1,664 14.94
    RFQ
    		317-43-119-41-005000

    Datasheet

         		317 Bulk Active SIP 19 (1 x 19) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-316-41-001000

    612-41-316-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 1,340 14.51
    RFQ
    		612-41-316-41-001000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-316-41-001000

    612-91-316-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,705 14.51
    RFQ
    		612-91-316-41-001000

    Datasheet

         		612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-632-41-605000

    110-93-632-41-605000

    CONN IC DIP SOCKET 32POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,506 14.75
    RFQ
    		110-93-632-41-605000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-632-41-605000

    110-43-632-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,415 14.75
    RFQ
    		110-43-632-41-605000

    Datasheet

         		110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    32-6551-10

    32-6551-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 2,559 16.21
    RFQ
    		32-6551-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3554-10

    32-3554-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 3,548 16.21
    RFQ
    		32-3554-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6556-10

    44-6556-10

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    		 1,065 15.97
    RFQ
    		44-6556-10

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
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