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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
212-1-06-003

212-1-06-003

CONN IC DIP SOCKET 6POS GOLD

CNC Tech

1,989 0.00
RFQ
212-1-06-003

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
211-1-18-003

211-1-18-003

CONN IC DIP SOCKET 18POS GOLD

CNC Tech

3,949 1.36
RFQ
211-1-18-003

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
233-84

233-84

CONN SOCKET PLCC 84POS TIN

CNC Tech

4,146 0.00
RFQ
233-84

Datasheet

- Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
231-44

231-44

CONN SOCKET PLCC 44POS GOLD

CNC Tech

1,903 0.00
RFQ
231-44

Datasheet

- Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Gold - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
212-1-08-003

212-1-08-003

CONN IC DIP SOCKET 8POS GOLD

CNC Tech

3,713 0.00
RFQ
212-1-08-003

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
210-1-24-006

210-1-24-006

CONN IC DIP SOCKET 24POS GOLD

CNC Tech

2,144 1.00
RFQ
210-1-24-006

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
210-1-32-006

210-1-32-006

CONN IC DIP SOCKET 32POS GOLD

CNC Tech

2,039 1.27
RFQ
210-1-32-006

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
211-1-40-006

211-1-40-006

CONN IC DIP SOCKET 40POS GOLD

CNC Tech

2,563 2.52
RFQ
211-1-40-006

Datasheet

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
212-1-14-003

212-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech

1,833 0.00
RFQ
212-1-14-003

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
212-1-16-003

212-1-16-003

CONN IC DIP SOCKET 16POS GOLD

CNC Tech

3,090 0.00
RFQ
212-1-16-003

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
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