Chuangxin Cloud - IC Sockets - Sockets for ICs, Transistors | Page 4 | Genuine Components, Fast Shipping

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
211-1-16-003 CONN IC DIP SOCKET 16POS GOLD CNC Tech	2,618	1.23	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C
211-1-20-003 CONN IC DIP SOCKET 20POS GOLD CNC Tech	216	1.53	RFQ	Datasheet	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C
211-1-24-006 CONN IC DIP SOCKET 24POS GOLD CNC Tech	785	1.66	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	24 (2 x 12)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C
211-1-28-006 CONN IC DIP SOCKET 28POS GOLD CNC Tech	281	1.83	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C
245-32-1-06 CONN IC DIP SOCKET 32POS TIN CNC Tech	873	0.78	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole, Kinked Pin	Open Frame	Solder	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
211-1-32-006 CONN IC DIP SOCKET 32POS GOLD CNC Tech	4,242	2.13	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	32 (2 x 16)	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-55°C ~ 105°C
210-1-40-006 CONN IC DIP SOCKET 40POS GOLD CNC Tech	4,737	2.80	RFQ	Datasheet	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polybutylene Terephthalate (PBT)	-40°C ~ 105°C
232-20 CONN SOCKET PLCC 20POS TIN CNC Tech	4,721	0.00	RFQ	Datasheet	-	Tube	Obsolete	PLCC	20 (4 x 5)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
232-32 CONN SOCKET PLCC 32POS TIN CNC Tech	2,152	0.00	RFQ	Datasheet	-	Tube	Obsolete	PLCC	32 (4 x 8)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C
232-28 CONN SOCKET PLCC 28POS TIN CNC Tech	3,998	0.00	RFQ	Datasheet	-	Tube	Obsolete	PLCC	28 (4 x 7)	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Surface Mount	Closed Frame	Solder	0.050" (1.27mm)	Tin	100.0µin (2.54µm)	Phosphor Bronze	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 105°C

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