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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    21-7438-10

    21-7438-10

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    		 4,843 15.62
    RFQ
    		21-7438-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-7530-10

    21-7530-10

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    		 4,575 15.62
    RFQ
    		21-7530-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-7562-10

    21-7562-10

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    		 3,347 15.62
    RFQ
    		21-7562-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-6823-90

    22-6823-90

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 2,010 15.62
    RFQ
    		22-6823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    26-6823-90T

    26-6823-90T

    CONN IC DIP SOCKET 26POS TIN

    Aries Electronics

    		 3,010 15.62
    RFQ
    		26-6823-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    36-3513-10H

    36-3513-10H

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 3,127 11.72
    RFQ
    		36-3513-10H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-3570-10

    24-3570-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,845 14.50
    RFQ
    		24-3570-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6570-10

    24-6570-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 3,844 14.50
    RFQ
    		24-6570-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6518-10E

    40-6518-10E

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,531 14.24
    RFQ
    		40-6518-10E

    Datasheet

         		518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-0501-21

    18-0501-21

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    		 3,606 15.69
    RFQ
    		18-0501-21

    Datasheet

         		501 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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