Welcome to Chuangxin Cloud!

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
48-6513-10H

48-6513-10H

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

2,159 11.47
RFQ
48-6513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
17-0501-30

17-0501-30

CONN SOCKET SIP 17POS TIN

Aries Electronics

2,133 12.62
RFQ
17-0501-30

Datasheet

501 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
64-9518-11

64-9518-11

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

3,189 12.62
RFQ
64-9518-11

Datasheet

518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
28-PGM06002-10

28-PGM06002-10

CONN SOCKET PGA GOLD

Aries Electronics

2,485 12.80
RFQ
28-PGM06002-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
18-3508-202

18-3508-202

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,403 12.67
RFQ
18-3508-202

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-6556-10

28-6556-10

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,009 12.69
RFQ
28-6556-10

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
10-0511-11

10-0511-11

CONN SOCKET SIP 10POS GOLD

Aries Electronics

4,387 14.14
RFQ
10-0511-11

Datasheet

511 Tube Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
22-6820-90C

22-6820-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,276 12.73
RFQ
22-6820-90C

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
68-PGM11032-10

68-PGM11032-10

CONN SOCKET PGA GOLD

Aries Electronics

2,289 15.47
RFQ
68-PGM11032-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
68-PGM11033-10

68-PGM11033-10

CONN SOCKET PGA GOLD

Aries Electronics

1,725 15.47
RFQ
68-PGM11033-10

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
Total 4131 Record«Prev1... 225226227228229230231232...414Next»
One-stop procurement solution
One-stop procurement solution
Cost down and save your time
Cost down and save your time
Reliable package and fast delivery
Reliable package and fast delivery
365 days after-sales service and warranty
365 days after-sales service and warranty
Chuangxin Cloud

HOME

Chuangxin Cloud

PRODUCT

Chuangxin Cloud

E-mail

Chuangxin Cloud

USER