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IC Sockets
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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28-6553-10CONN IC DIP SOCKET ZIF 28POS GLD Aries Electronics |
1,488 | 15.22 |
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Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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17-0508-21CONN SOCKET SIP 17POS GOLD Aries Electronics |
3,174 | 14.98 |
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Datasheet |
508 | Bulk | Active | SIP | 17 (1 x 17) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
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17-0508-31CONN SOCKET SIP 17POS GOLD Aries Electronics |
2,408 | 14.98 |
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Datasheet |
508 | Bulk | Active | SIP | 17 (1 x 17) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 125°C |
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09-0511-11CONN SOCKET SIP 9POS GOLD Aries Electronics |
3,243 | 13.70 |
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Datasheet |
511 | Bulk | Active | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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19-71080-10CONN SOCKET SIP 19POS TIN Aries Electronics |
2,970 | 15.00 |
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Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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19-7375-10CONN SOCKET SIP 19POS TIN Aries Electronics |
2,432 | 15.00 |
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Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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19-7400-10CONN SOCKET SIP 19POS TIN Aries Electronics |
2,252 | 15.00 |
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Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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19-7650-10CONN SOCKET SIP 19POS TIN Aries Electronics |
2,964 | 15.00 |
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Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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19-7750-10CONN SOCKET SIP 19POS TIN Aries Electronics |
3,062 | 15.00 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 19 (1 x 19) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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20-81000-310CCONN IC DIP SOCKET 20POS GOLD Aries Electronics |
1,420 | 15.00 |
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Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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