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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    36-6513-11H

    36-6513-11H

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 1,807 14.62
    RFQ
    		36-6513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-0508-20

    32-0508-20

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 3,947 14.62
    RFQ
    		32-0508-20

    Datasheet

         		508 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    32-0508-30

    32-0508-30

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 1,314 14.62
    RFQ
    		32-0508-30

    Datasheet

         		508 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    32-1508-20

    32-1508-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 1,728 14.62
    RFQ
    		32-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    32-1508-30

    32-1508-30

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,702 14.62
    RFQ
    		32-1508-30

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    18-71000-10

    18-71000-10

    CONN SOCKET SIP 18POS TIN

    Aries Electronics

    		 2,360 14.64
    RFQ
    		18-71000-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-7500-10

    18-7500-10

    CONN SOCKET SIP 18POS TIN

    Aries Electronics

    		 2,077 14.64
    RFQ
    		18-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-7625-10

    18-7625-10

    CONN SOCKET SIP 18POS TIN

    Aries Electronics

    		 2,304 14.64
    RFQ
    		18-7625-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-7650-10

    18-7650-10

    CONN SOCKET SIP 18POS TIN

    Aries Electronics

    		 4,291 14.64
    RFQ
    		18-7650-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-7740-10

    18-7740-10

    CONN SOCKET SIP 18POS TIN

    Aries Electronics

    		 1,543 14.64
    RFQ
    		18-7740-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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