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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Aries Electronics
全部重置
应用所有
结果: 4131
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
04-1518-10T

04-1518-10T

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

1,316 0.62
RFQ
04-1518-10T

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
03-0513-10

03-0513-10

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,543 0.58
RFQ
03-0513-10

Datasheet

0513 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-0518-10H

04-0518-10H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

1,868 0.64
RFQ
04-0518-10H

Datasheet

518 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-1518-10H

04-1518-10H

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

3,477 0.64
RFQ
04-1518-10H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
05-0518-10

05-0518-10

CONN SOCKET SIP 5POS GOLD

Aries Electronics

2,781 0.64
RFQ
05-0518-10

Datasheet

518 Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
01-0503-20

01-0503-20

CONN SOCKET SIP 1POS GOLD

Aries Electronics

3,869 0.67
RFQ
01-0503-20

Datasheet

0503 Bulk Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
01-0503-30

01-0503-30

CONN SOCKET SIP 1POS GOLD

Aries Electronics

2,167 0.67
RFQ
01-0503-30

Datasheet

0503 Bulk Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap - Tin 30.0µin (0.76µm) Brass Polyamide (PA), Nylon, Glass Filled -
04-1518-00

04-1518-00

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

1,019 0.69
RFQ
04-1518-00

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0518-11H

02-0518-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

1,123 0.69
RFQ
02-0518-11H

Datasheet

518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-1518-11H

02-1518-11H

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

1,559 0.69
RFQ
02-1518-11H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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