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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
01-0513-10H

01-0513-10H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

4,873 0.42
RFQ
01-0513-10H

Datasheet

0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0513-10

02-0513-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

2,603 0.42
RFQ
02-0513-10

Datasheet

0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
03-0518-10

03-0518-10

CONN SOCKET SIP 3POS GOLD

Aries Electronics

4,457 0.45
RFQ
03-0518-10

Datasheet

518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
01-0513-11H

01-0513-11H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

4,452 0.45
RFQ
01-0513-11H

Datasheet

0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
03-0518-00

03-0518-00

CONN SOCKET SIP 3POS GOLD

Aries Electronics

3,890 0.45
RFQ
03-0518-00

Datasheet

518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0518-11

02-0518-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

1,095 0.45
RFQ
02-0518-11

Datasheet

518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-1518-11

02-1518-11

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

4,804 0.45
RFQ
02-1518-11

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
02-0513-10T

02-0513-10T

CONN SOCKET SIP 2POS GOLD

Aries Electronics

1,905 0.40
RFQ
02-0513-10T

Datasheet

0513 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
03-0518-10T

03-0518-10T

CONN SOCKET SIP 3POS GOLD

Aries Electronics

1,423 0.53
RFQ
03-0518-10T

Datasheet

518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
01-0517-90C

01-0517-90C

CONN SOCKET SIP 1POS GOLD

Aries Electronics

4,899 0.53
RFQ
01-0517-90C

Datasheet

0517 Bulk Active SIP 1 (1 x 1) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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