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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Aries Electronics
全部重置
应用所有
结果: 4131
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
11-0508-21

11-0508-21

CONN SOCKET SIP 11POS GOLD

Aries Electronics

2,425 9.78
RFQ
11-0508-21

Datasheet

508 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
11-0508-31

11-0508-31

CONN SOCKET SIP 11POS GOLD

Aries Electronics

3,520 9.78
RFQ
11-0508-31

Datasheet

508 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
12-8312-310C

12-8312-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

1,328 9.78
RFQ
12-8312-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-8355-310C

12-8355-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

3,077 9.78
RFQ
12-8355-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-8358-310C

12-8358-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

2,402 9.78
RFQ
12-8358-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-8450-310C

12-8450-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

1,779 9.78
RFQ
12-8450-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
12-8510-310C

12-8510-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

4,690 9.78
RFQ
12-8510-310C

Datasheet

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
23-0517-90C

23-0517-90C

CONN SOCKET SIP 23POS GOLD

Aries Electronics

1,115 9.78
RFQ
23-0517-90C

Datasheet

0517 Bulk Active SIP 23 (1 x 23) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
19-0511-10

19-0511-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

4,292 7.84
RFQ
19-0511-10

Datasheet

511 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
39-0511-10

39-0511-10

CONN SOCKET SIP 39POS TIN

Aries Electronics

4,850 9.80
RFQ
39-0511-10

Datasheet

511 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
Total 4131 Record«Prev1... 146147148149150151152153...414Next»
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