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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
26-3513-10H

26-3513-10H

CONN IC DIP SOCKET 26POS GOLD

Aries Electronics

3,287 9.53
RFQ
26-3513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
28-C212-11

28-C212-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,987 9.53
RFQ
28-C212-11

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
28-C300-11

28-C300-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,075 9.53
RFQ
28-C300-11

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
12-0501-21

12-0501-21

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,852 9.55
RFQ
12-0501-21

Datasheet

501 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
12-0501-31

12-0501-31

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,014 9.55
RFQ
12-0501-31

Datasheet

501 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
34-0518-11H

34-0518-11H

CONN SOCKET SIP 34POS GOLD

Aries Electronics

1,909 9.56
RFQ
34-0518-11H

Datasheet

518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
34-1518-11H

34-1518-11H

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

3,555 9.56
RFQ
34-1518-11H

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-6820-90TWR

20-6820-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

3,048 9.56
RFQ
20-6820-90TWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
24-3518-10E

24-3518-10E

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,724 9.64
RFQ
24-3518-10E

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
11-0503-21

11-0503-21

CONN SOCKET SIP 11POS GOLD

Aries Electronics

1,062 9.58
RFQ
11-0503-21

Datasheet

0503 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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