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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
808-AG11D-ES-LF

808-AG11D-ES-LF

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

1,519 0.00
RFQ
808-AG11D-ES-LF

Datasheet

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
2-1571586-9

2-1571586-9

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

3,956 0.00
RFQ
2-1571586-9

Datasheet

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
508-AG10D

508-AG10D

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

2,227 0.00
RFQ
508-AG10D

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy - -55°C ~ 125°C
516-AG10D

516-AG10D

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

2,265 0.00
RFQ
516-AG10D

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
2-641616-1

2-641616-1

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors

3,643 0.00
RFQ
2-641616-1

Datasheet

Diplomate DL Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic -55°C ~ 105°C
5-1571551-0

5-1571551-0

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

2,423 0.00
RFQ
5-1571551-0

Datasheet

500 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
5-1571551-2

5-1571551-2

CONN IC DIP SOCKET 40POS GOLD

TE Connectivity AMP Connectors

4,187 2.07
RFQ
5-1571551-2

Datasheet

500 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
4-1571551-4

4-1571551-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

4,664 0.00
RFQ
4-1571551-4

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
1-1571994-0

1-1571994-0

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors

1,760 5.52
RFQ
1-1571994-0

Datasheet

510 Tube Obsolete SIP 10 (1 x 10) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 20.0µin (0.51µm) Copper Thermoplastic, Polyester -
643648-3

643648-3

CONN SOCKET SIP 16POS TIN

TE Connectivity AMP Connectors

1,809 0.00
RFQ
643648-3

Datasheet

Diplomate DL Box Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
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