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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
2-382470-4

2-382470-4

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

2,725 0.00
RFQ
2-382470-4

Datasheet

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Phosphor Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
345725-5

345725-5

CONN IC DIP SOCKET 22POS TINLEAD

TE Connectivity AMP Connectors

2,011 0.00
RFQ

-

- Tube Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin-Lead - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - - - -
824-AG31D-ESL-LF

824-AG31D-ESL-LF

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

4,784 0.00
RFQ
824-AG31D-ESL-LF

Datasheet

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
1-1437537-9

1-1437537-9

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

1,110 0.00
RFQ
1-1437537-9

Datasheet

800 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - - -
1-1437542-1

1-1437542-1

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

3,468 0.00
RFQ
1-1437542-1

Datasheet

700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
832-AG11D-ESL

832-AG11D-ESL

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

2,784 1.95
RFQ
832-AG11D-ESL

Datasheet

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead - Copper Alloy Polyester -55°C ~ 105°C
3-1437535-4

3-1437535-4

CONN SOCKET SIP 20POS GOLD

TE Connectivity AMP Connectors

3,712 0.00
RFQ
3-1437535-4

Datasheet

500 Bulk Obsolete SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper - -
5-1571552-0

5-1571552-0

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

1,553 3.33
RFQ
5-1571552-0

Datasheet

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
4-1571551-6

4-1571551-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

4,662 1.85
RFQ
4-1571551-6

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
2-1571551-4

2-1571551-4

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

4,800 0.00
RFQ
2-1571551-4

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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