Core Industry Hot News

Upstream Dynamics

• Texas Instruments (TI) Rumored to Raise Prices by 15%–85%
  It is reported that Texas Instruments (TI) has announced a new round of price increases for some semiconductor products starting April 1, 2026, with hikes ranging from 15% to 85%. The affected core product lines include digital isolators and power management ICs. The new prices will apply to both direct customers and those purchasing through distribution channels, meaning nearly all downstream buyers will be impacted.
• NXP to Implement Product Price Increases Starting April 1
  It is reported that NXP has officially announced price adjustment plans: starting April 1, 2026, it will raise prices for some product portfolios (the specific list of affected products has not been fully disclosed). Distributors' book prices will be updated by March 30, and they will be provided with detailed lists of affected products and new prices in advance to ensure orderly adjustments for both channels and end - customers.
• Mature - node Wafer Foundries Face Another Round of Price Hikes
  Reports show that mature - node wafer foundries such as UMC, Vanguard International Semiconductor (VIS), and Powerchip plan to raise quotations as early as April, with increases of up to 10% or more. In addition, major mature - node customers (IC design houses led by driver ICs) also plan to raise prices due to rising costs.
• Nexchip's Wafer Foundry Prices to Rise by 10%
  It is reported that Nexchip issued a "Wafer Foundry Service Product Price Adjustment Announcement" to customers on March 12, 2026. The announcement states that wafers produced from 00:00 on June 1, 2026, will see a 10% price increase. This price hike is driven by multiple factors including international situations, supply chain fluctuations, and rising raw material prices.

Enterprise Dynamics

• Infineon Tops Global MCU Market with 23.2% Share
  Infineon announced on March 10 that it has further consolidated its leading position in the global MCU market. According to Omdia, Infineon increased its MCU market share to 23.2% in 2025 (a year - on - year increase of 1.8 percentage points), achieving this growth against the backdrop of a slight decline in the overall MCU market (-0.3%). Infineon ranked first in the global MCU market for the first time in 2024, and had already become the top player in the automotive MCU market the previous year.
• NXP Releases i.MX 93W Processor
  NXP launched the i.MX 93W application processor on March 9. Designed to accelerate the deployment of physical AI, this chip integrates a dedicated AI NPU and secure tri - band wireless connectivity into a single package. Its highly integrated design can replace up to 60 discrete components, enabling scalable edge computing, AI acceleration, and secure wireless connectivity.
• STMicroelectronics Releases ST64UWB Ultra - wideband Chip
  STMicroelectronics (ST) released the ST64UWB series of ultra - wideband (UWB) chips on March 10. This is the industry's first SoC chip to fully support the next - generation IEEE .15.4ab802 standard. The series features a complete automotive - grade product line, optimized for different scenarios, and also includes models for consumer electronics and industrial applications.
• GigaDevice Expands Capacity Across Its Entire GD25UF Series NOR Flash Line
  GigaDevice announced that its 1.2V ultra - low - power SPI NOR Flash GD25UF series has achieved full - range capacity expansion from 8Mb to 256Mb, precisely meeting differentiated needs across various application scenarios from high - performance AI computing to low - power battery - powered devices. The GD25UF series enables seamless integration with 1.2V main control power systems, significantly reducing the number of peripheral components.
• GigaDevice Launches GD32M531 Series MCU
  GigaDevice announced the release of the GD32M531 series 32 - bit MCU, specially designed for motor control scenarios. With Arm Cortex - M33 as its core, it provides high - efficiency, cost - effective solutions for various motor control applications including air conditioner outdoor units, air source heat pumps, washing machines / dryers, dishwashers, and multi - head induction cooktops.
• SmartSens Releases 12 - Megapixel AI Glasses CMOS Image Sensor
  SmartSens launched the new 12 - megapixel AI glasses application CMOS image sensor SC1220IOT. Manufactured using 55nm Stacked BSI full - domestic advanced process, this product meets the high - quality imaging upgrade needs of AI glasses, AR / VR, and other intelligent wearable devices. The sensor is now available for sampling and will enter mass production in the second quarter of 2026.
• Chengdu Huami Releases Ultra - high - speed 10 - bit 128GSPS A/D Converter
  Chengdu Huami announced that its self - developed ultra - high - speed 10 - bit 128GSPS A/D converter, the CSD10B128GA1, has been successfully launched. This 10 - bit, 128GSPS ultra - high - speed ADC supports direct RF sampling of the Ka band and below.
• Winbond's Revenue Soared 89% in the First Two Months
  Top distributor Winbond Technology reported a combined revenue of NT $104.4 billion in February 2026 (a year - on - year increase of 29%). As of February 2026, cumulative combined revenue reached NT $300.2 billion (a year - on - year increase of 89.1%). Business growth is attributed to high prosperity in AI data center - related businesses, the completion of inventory adjustments in European and US markets, restocking at the terminal, and steady recovery in non - AI application fields.

Application - side Dynamics

• Multiple Mobile Brands Launch Collective Price Hikes
  Media reports indicate that multiple mobile phone manufacturers (including OPPO, OnePlus, vivo, Xiaomi / Redmi, and Honor) have adjusted prices for their products. The price adjustment window for these brands is concentrated in mid - to - late March 2026, forming the largest - scale collective price hike in nearly five years. Large - storage versions are the focus of the price increases, while the industry generally reduces low - end product lines, leading to a rapid contraction of the thousand - yuan mobile phone market.
• Gree Electric's Silicon Carbide Power Chips Debut at AWE
  Gree Electric's silicon carbide power chips made their debut at the AWE exhibition. The product matrix covers silicon carbide SBD wafers and devices, silicon carbide MOSFET wafers and devices, etc. Gree stated that it is currently advancing the R & D of next - generation advanced SiC devices such as silicon carbide JFETs, trench MOSFETs, and superjunction MOSFETs.
• Honda Cancels Three Pure Electric Vehicle Plans in North America
  Honda recently announced the cancellation of R & D and launch plans for three pure electric vehicle models originally intended for the North American market. Recent policy changes in the US market, including relaxed regulations on fossil fuels and adjustments to electric vehicle subsidy policies, have slowed down the expansion of the pure electric vehicle market, which is the reason for this decision.
• NVIDIA and Samsung to Jointly Promote Commercialization of Ferroelectric NAND Flash
  Reports show that NVIDIA has joined Samsung Electronics' R & D efforts to co - develop new AI technologies and jointly research ferroelectric NAND flash. This technology enables stacking up to 1000 layers and can reduce power consumption by up to 96%, providing a new solution for the industry.

Data & Outlook

• Omdia: Due to the sharp rise in memory prices, global shipments of desktops, notebooks, and workstations in 2026 are expected to decline by 12% to 245 million units. Among them, desktop shipments are expected to drop by 10% to 53.2 million units, and notebook shipments will fall by 12% to 192.2 million units. Data shows that since the first quarter of 2025, the cost of mainstream memory and storage configurations has risen by $90 to $165, putting huge financial pressure on PC manufacturers.
• TrendForce: NVIDIA's next - generation AI computing architecture indicates that future GPU design will shift focus to higher - density chip - to - chip interconnection and faster data transmission. Large - scale interconnection within racks and across racks will become the core task in planning data centers. Therefore, it is estimated that CPO (Co - Packaged Optics) penetration in optical communication modules for AI data centers will grow year by year, with a chance to reach 35% by 2030.
• TrendForce: The world's top ten wafer foundry companies achieved a production value of $16.4969 billion in 2025, a year - on - year increase of 26.3%. Among them, TSMC's output value reached $11.1543 billion, a year - on - year increase of 36.1%. Looking ahead to 2026, the first half will still see some consumer electronics products pre - stocking to stabilize capacity utilization, while the second half will face threats to order volumes and capacity utilization from weak demand caused by rising memory prices.
• General Administration of Customs: In the first two months of 2026, China's total import and export value of goods trade reached 7.73 trillion RMB, a year - on - year increase of 18.3%. Exports of electromechanical products performed outstandingly: in the first two months, China's exports of electromechanical products reached 2.89 trillion RMB, a year - on - year increase of 24.3%. Among them, integrated circuit exports reached 304.67 billion RMB, a year - on - year increase of 68.9%.