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AMD XCZU46DR-L2FSVH1760I

Part No.:
XCZU46DR-L2FSVH1760I
Manufacturer:
AMD
Category:
System On Chip (SoC)
Package:
1760-BBGA, FCBGA
Datasheet:
Chuangxin CloudXCZU46DR-L2FSVH1760I.pdf
Description:
IC ZUP RFSOC A53 FPGA LP 1760BGA
Quantity:

Unit Price:$0

Ext Price:$0

Payment:
Payment
Shipping:
Shipping

Product details

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Product attributes
Attribute value
Manufacturer:
AMD
Series:
Zynq® UltraScale+™ RFSoC
Package/Case:
1760-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DDR, DMA, PCIe
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 1.333GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1760-FCBGA (42.5x42.5)
Datasheet:
Chuangxin CloudXCZU46DR-L2FSVH1760I.pdf

1. How to order XCZU46DR-L2FSVH1760I on Chuangxin Cloud?

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2. How does Chuangxin Cloud guarantee that XCZU46DR-L2FSVH1760I is from the original manufacturer or authorized agents?

We have a professional and experienced quality control team to strictly verify and test the XCZU46DR-L2FSVH1760I. All suppliers must pass our qualification reviews before they can publish their products including XCZU46DR-L2FSVH1760I on Chuangxin Cloud; we pay more attention to the channels and quality of XCZU46DR-L2FSVH1760I products than any other customer. We strictly implement supplier audits, so you can purchase with confidence.

3. Are the XCZU46DR-L2FSVH1760I price and inventory displayed accurate?

The price and inventory of XCZU46DR-L2FSVH1760I fluctuates frequently and cannot be updated in time, it will be updated periodically within 24 hours. And, our quotation usually expires after 5 days.

4. What forms of payment are accepted?

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Once your order has been processed for shipment, our salesperson will send you an email advising you of the shipping status and tracking number.

Warm Tips: It may take up to 24 hours for the carriers to display tracking information. Usually, express delivery takes 3-5 days, and registered mail takes 25-60 days.

6. What is the process for return or replacement of XCZU46DR-L2FSVH1760I?

All goods will implement Pre-Shipment Inspection (PSI), selected at random from all batches of your order to do a systematic inspection before arranging the shipment. If there is something wrong with the XCZU46DR-L2FSVH1760I we delivered, we will accept the replacement or return of the XCZU46DR-L2FSVH1760I only when all of the below conditions are fulfilled:

(1)Such as a deficiency in quantity, delivery of wrong items, and apparent external defects (breakage and rust, etc.), and we acknowledge such problems.

(2)We are informed of the defect described above within 90 days after the delivery of XCZU46DR-L2FSVH1760I.

(3)The PartNo is unused and only in the original unpacked packaging.

Two processes to return the products:

(1)Inform us within 90 days

(2)Obtain Requesting Return Authorizations

7.How to contact us to get technical supports, such as XCZU46DR-L2FSVH1760I pin diagram, XCZU46DR-L2FSVH1760I datasheet?

If you need any after-sales service, please do not hesitate to contact us.

Image XCZU46DR-1FFVH1760E XCZU46DR-1FSVH1760E XCZU46DR-1FSVH1760I XCZU46DR-1FFVH1760I XCZU46DR-L1FFVH1760I
Part Number XCZU46DR-1FFVH1760E XCZU46DR-1FSVH1760E XCZU46DR-1FSVH1760I XCZU46DR-1FFVH1760I XCZU46DR-L1FFVH1760I
Manufacturer AMD AMD AMD AMD AMD
Series Zynq® UltraScale+™ RFSoC Zynq® UltraScale+™ RFSoC Zynq® UltraScale+™ RFSoC Zynq® UltraScale+™ RFSoC Zynq® UltraScale+™ RFSoC
Package/Case 1760-BBGA, FCBGA 1760-BBGA, FCBGA 1760-BBGA, FCBGA 1760-BBGA, FCBGA 1760-BBGA, FCBGA
Packaging Tray Tray Tray Tray Tray
Product Status Active Active Active Active Active
Architecture MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA MCU, FPGA
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size - - - - -
RAM Size 256KB 256KB 256KB 256KB 256KB
Peripherals DDR, DMA, PCIe DDR, DMA, PCIe DDR, DMA, PCIe DDR, DMA, PCIe DDR, DMA, PCIe
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 1.333GHz 533MHz, 1.333GHz 533MHz, 1.333GHz 533MHz, 1.333GHz 533MHz, 1.333GHz
Primary Attributes Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
Operating Temperature -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ) -40°C ~ 100°C (TJ)
Grade - - - - -
Qualification - - - - -
Supplier Device Package 1760-FCBGA (42.5x42.5) 1760-FCBGA (42.5x42.5) 1760-FCBGA (42.5x42.5) 1760-FCBGA (42.5x42.5) 1760-FCBGA (42.5x42.5)
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