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制造商 Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature





























































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Composition Diameter Melting Point Flux Type Wire Gauge Mesh Type Process Form Shelf Life Shelf Life Start Storage/Refrigeration Temperature
SMD291SNLT6

SMD291SNLT6

SOLDER PASTE NO CLEAN LEAD-FREE

Chip Quik Inc.

3,382 45.95
RFQ
SMD291SNLT6

Datasheet

SMD Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 422 ~ 428°F (217 ~ 220°C) No-Clean - 6 Lead Free Syringe, 0.53 oz (15g), 5cc 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD3SW.020 8OZ

SMD3SW.020 8OZ

SOLDER WIRE 62/36/2 TIN/LEAD/SIL

Chip Quik Inc.

3,209 46.34
RFQ
SMD3SW.020 8OZ

Datasheet

SMD3 Bulk Active Wire Solder Sn62Pb36Ag2 (62/36/2) 0.020" (0.51mm) 354°F (179°C) No-Clean, Water Soluble 24 AWG, 25 SWG - Leaded Spool, 8 oz (227g), 1/2 lb - - -
NC191LTA250

NC191LTA250

SMOOTH FLOW LOW TEMP SOLDER PAST

Chip Quik Inc.

4,808 57.95
RFQ
NC191LTA250

Datasheet

Smooth Flow™ Bulk Active Solder Paste Bi57Sn42Ag1 (57/42/1) - 279°F (137°C) No-Clean - 4 - Jar, 8.8 oz (250g) 12 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
NC2SWLF.020 1LB

NC2SWLF.020 1LB

LF SOLDER WIRE 99.3/0.7 TIN/COPP

Chip Quik Inc.

3,145 64.03
RFQ
NC2SWLF.020 1LB

Datasheet

- Bulk Active Wire Solder Sn99.3Cu0.7 (99.3/0.7) 0.020" (0.51mm) 441°F (227°C) No-Clean 24 AWG, 25 SWG - Lead Free Spool, 1 lb (454 g) - - -
NC3SW.031 1LB

NC3SW.031 1LB

SOLDER WIRE 62/36/2 TIN/LEAD/SIL

Chip Quik Inc.

2,090 75.54
RFQ
NC3SW.031 1LB

Datasheet

- Bulk Active Wire Solder Sn62Pb36Ag2 (62/36/2) 0.031" (0.79mm) 354°F (179°C) No-Clean 20 AWG, 21 SWG - Leaded Spool, 1 lb (454 g) - - -
NC191SNL250T5

NC191SNL250T5

SMOOTH FLOW LEAD-FREE SOLDER PAS

Chip Quik Inc.

3,024 87.95
RFQ
NC191SNL250T5

Datasheet

Smooth Flow™ Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 422 ~ 428°F (217 ~ 220°C) No-Clean - 5 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
TS391AX500C

TS391AX500C

THERMALLY STABLE SOLDER PASTE NO

Chip Quik Inc.

1,232 97.50
RFQ
TS391AX500C

Datasheet

- Bulk Active Solder Paste Sn63Pb37 (63/37) - 361°F (183°C) No-Clean - 4 Leaded Cartridge, 17.64 oz (500g) 12 Months Date of Manufacture 68°F ~ 77°F (20°C ~ 25°C)
SMD291SNL50T6

SMD291SNL50T6

SOLDER PASTE IN JAR 50G (T6) SAC

Chip Quik Inc.

3,851 99.95
RFQ
SMD291SNL50T6

Datasheet

SMD Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 422 ~ 428°F (217 ~ 220°C) No-Clean - 6 Lead Free Jar, 1.76 oz (50g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD4300SNL250T5

SMD4300SNL250T5

SOLDER PASTE SAC305 250G T5

Chip Quik Inc.

3,033 103.95
RFQ
SMD4300SNL250T5

Datasheet

CHIPQUIK® SMD4300 Bulk Active Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) - 423 ~ 428°F (217 ~ 220°C) No-Clean, Water Soluble - 5 Lead Free Jar, 8.8 oz (250g) 6 Months Date of Manufacture 37°F ~ 46°F (3°C ~ 8°C)
SMD2020

SMD2020

SOLDER SPHERES SN96.5/AG3.0/CU0.

Chip Quik Inc.

1,183 125.95
RFQ
SMD2020

Datasheet

SMD2 Bulk Active Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) 0.010" (0.25mm) 423 ~ 428°F (217 ~ 220°C) - - - Lead Free Jar 24 Months Date of Manufacture -
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