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Socket Adapters

制造商 Series Packaging Product Status Convert From (Adapter End) Convert To (Adapter End) Number of Pins Pitch - Mating Contact Finish - Mating Mounting Type Termination Pitch - Post Contact Finish - Post Housing Material Board Material













































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Convert From (Adapter End) Convert To (Adapter End) Number of Pins Pitch - Mating Contact Finish - Mating Mounting Type Termination Pitch - Post Contact Finish - Post Housing Material Board Material
18-354000-10

18-354000-10

SOCKET ADAPTER DIP TO 18SOIC

Aries Electronics

2,651 0.00
RFQ
18-354000-10

Datasheet

Correct-A-Chip® 354000 Bulk Active DIP, 0.3" (7.62mm) Row Spacing SOIC 18 0.100" (2.54mm) Gold Surface Mount Solder 0.050" (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
32-354000-10

32-354000-10

SOCKET ADAPTER DIP TO 32SOIC

Aries Electronics

3,874 0.00
RFQ
32-354000-10

Datasheet

Correct-A-Chip® 354000 Bulk Active DIP, 0.3" (7.62mm) Row Spacing SOIC 32 - Gold Surface Mount Solder 0.100" (2.54mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
20-352000-10

20-352000-10

SOCKET ADAPTER PLCC TO 20DIP 0.3

Aries Electronics

2,418 0.00
RFQ
20-352000-10

Datasheet

Correct-A-Chip® 352000 Bulk Active PLCC DIP, 0.3" (7.62mm) Row Spacing 20 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
20-353000-10

20-353000-10

SOCKET ADAPTER PLCC TO 20DIP 0.3

Aries Electronics

3,469 0.00
RFQ
20-353000-10

Datasheet

Correct-A-Chip® 353000 Bulk Active PLCC DIP, 0.3" (7.62mm) Row Spacing 20 0.050" (1.27mm) Tin-Lead Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
28-352000-10

28-352000-10

SOCKET ADAPTER PLCC TO 28DIP 0.3

Aries Electronics

1,092 0.00
RFQ
28-352000-10

Datasheet

Correct-A-Chip® 352000 Bulk Active PLCC DIP, 0.3" (7.62mm) Row Spacing 28 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
28-353000-10

28-353000-10

SOCKET ADAPTER PLCC TO 28DIP 0.3

Aries Electronics

2,052 0.00
RFQ
28-353000-10

Datasheet

Correct-A-Chip® 353000 Bulk Active PLCC DIP, 0.3" (7.62mm) Row Spacing 28 0.050" (1.27mm) Tin-Lead Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
1111163

1111163

SOCKET ADAPTER SOCKET TO 40PLCC

Aries Electronics

1,987 0.00
RFQ
1111163

Datasheet

Correct-A-Chip® 1111163 Bulk Active Socket, 0.6" (15.24mm) Row Spacing PLCC 40 - Gold - - - - Polyamide (PA46), Nylon 4/6, Glass Filled FR4 Epoxy Glass
10-665000-00

10-665000-00

SCK ADAPT 10P SOIC-W TO SOIC 0.6

Aries Electronics

2,776 0.00
RFQ
10-665000-00

Datasheet

Correct-A-Chip® 665000 Bulk Active SOIC-W SOIC 10 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
12-665000-00

12-665000-00

SCK ADAPT 12P SOIC-W TO SOIC 0.6

Aries Electronics

2,923 0.00
RFQ
12-665000-00

Datasheet

Correct-A-Chip® 665000 Bulk Active SOIC-W SOIC 12 0.050" (1.27mm) - Surface Mount Solder 0.050" (1.27mm) Tin-Lead - FR4 Epoxy Glass
1111903

1111903

SOCKET ADAPT SOWIC TO 24DIP 0.4

Aries Electronics

1,285 0.00
RFQ
1111903

Datasheet

Correct-A-Chip® 1111903 Bulk Active SOWIC DIP, 0.4" (10.16mm) Row Spacing 24 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
24-354W00-20

24-354W00-20

DIP-TO-SOWIC ADAPTER

Aries Electronics

4,657 0.00
RFQ
24-354W00-20

Datasheet

Correct-A-Chip® 354W00 Bulk Active DIP, 0.3" (7.62mm) Row Spacing SOWIC 24 0.100" (2.54mm) Gold Through Hole Solder 0.050" (1.27mm) Tin-Lead Polyamide (PA46), Nylon 4/6, Glass Filled -
22-304504-18

22-304504-18

SOCKET ADAPTER SOIC TO 22DIP 0.4

Aries Electronics

2,432 0.00
RFQ
22-304504-18

Datasheet

Correct-A-Chip® 304504 Bulk Active SOIC DIP, 0.4" (10.16mm) Row Spacing 22 0.050" (1.27mm) - Through Hole Solder 0.100" (2.54mm) Tin-Lead - FR4 Epoxy Glass
7131-108-18

7131-108-18

SOCKET ADAPT HB2E RELAY TO 8DIP

Aries Electronics

1,189 0.00
RFQ
7131-108-18

Datasheet

- Bulk Active HB2E Relay DIP, 0.3" (7.62mm) Row Spacing 8 - - Through Hole Solder - Tin-Lead - FR4 Epoxy Glass
18-354000-11-RC

18-354000-11-RC

SOCKET ADAPTER DIP TO 18SOIC

Aries Electronics

1,650 0.00
RFQ
18-354000-11-RC

Datasheet

Correct-A-Chip® 354000 Bulk Active DIP, 0.3" (7.62mm) Row Spacing SOIC 18 0.100" (2.54mm) Gold Surface Mount Solder 0.050" (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
18-354000-21-RC

18-354000-21-RC

SOCKET ADAPTER DIP TO 18SOIC

Aries Electronics

3,683 0.00
RFQ
18-354000-21-RC

Datasheet

Correct-A-Chip® 354000 Bulk Active DIP, 0.3" (7.62mm) Row Spacing SOIC 18 0.100" (2.54mm) Gold Surface Mount Solder 0.050" (1.27mm) Gold Polyamide (PA46), Nylon 4/6, Glass Filled -
16-307349-11-RC

16-307349-11-RC

SOCKET ADAPTER PLCC TO 16DIP 0.3

Aries Electronics

4,465 0.00
RFQ
16-307349-11-RC

Datasheet

Correct-A-Chip® 307349 Bulk Active PLCC DIP, 0.3" (7.62mm) Row Spacing 16 0.050" (1.27mm) Gold Through Hole Solder 0.100" (2.54mm) Gold - FR4 Epoxy Glass
MIKROE-231

MIKROE-231

SOCKET ADAPTER AT90PWM2 TO 40DIP

MikroElektronika

2,276 0.00
RFQ

-

- Bulk Obsolete AT90PWM2 DIP 40 - - - - - - - -
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