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IC Sockets
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2124-6313-9UA-1902TEST BURN-IN PGA |
3,311 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 124 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2209-6317-9UA-1902GRID ZIP |
3,063 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 209 (17 x 17) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2225-6317-9UA-1902TEXTOOL |
4,380 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2120-6313-9UA-1902PGA 13 X13 |
3,710 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 120 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2361-6319-9UA-1902GRID ZIP 19 X 19 |
4,414 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 361 (19 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2144-6315-9UA-1902GRID ZIP 15 X 15 |
1,938 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 144 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
244A-6313-9UA-1902TEXTOOL |
3,449 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 169 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2108-6313-9UA-1902GRID ZIP 13 X 13 |
2,430 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 108 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
284-6311-9UA-1902GRID ZIP 11 X 11 |
4,806 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 84 (11 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
224A-6313-9UA-1902TEXTOOL 13 X 13 PGA |
3,740 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 169 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2289-6317-9UA-1902GRID ZIP 17 X 17 |
3,284 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 289 (17 x 17) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2225-6315-9UA-1902GRID ZIP 15X15 |
4,200 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
272-6311-9UA-1902TEST BURN-IN PGA |
2,148 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 72 (11 x 11) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2180-6315-9UA-1902GRID ZIP 15 X 15 |
1,141 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Discontinued at Digi-Key | PGA, ZIF (ZIP) | 180 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2169-6317-9UA-1902PGA |
2,260 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 169 (17 x 17) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
272-6325-9UA-1902TEST BURN-IN PGA |
2,876 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 72 (25 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2184-6325-9UA-1902TEST BURN-IN PGA |
2,603 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 184 (25 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2141-6321-9UA-1902TEST AND BURN-IN PGA |
3,388 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 141 (21 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2192-6325-9UA-1902TEST BURN-IN PGA |
4,131 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 192 (25 x 25) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
|
2280-6319-9UA-1902TEXTOOL |
1,492 | 0.00 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 280 (19 x 19) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
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