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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
326-93-164-41-002000

326-93-164-41-002000

SOCKET WRAP SOLDERTAIL SIP 64POS

Mill-Max Manufacturing Corp.

2,254 25.25
RFQ
326-93-164-41-002000

Datasheet

326 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
2-822064-5

2-822064-5

CONN SOCKET PQFP 132POS TIN-LEAD

TE Connectivity AMP Connectors

2,399 0.00
RFQ
2-822064-5

Datasheet

- Tube Obsolete QFP 132 (4 x 33) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Liquid Crystal Polymer (LCP) -
100-PGM13061-11

100-PGM13061-11

CONN SOCKET PGA GOLD

Aries Electronics

4,232 27.43
RFQ
100-PGM13061-11

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
100-PGM13069-11

100-PGM13069-11

CONN SOCKET PGA GOLD

Aries Electronics

4,963 27.43
RFQ
100-PGM13069-11

Datasheet

PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
116-43-428-61-001000

116-43-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,118 24.90
RFQ

-

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-328-61-001000

116-93-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,703 24.90
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-448-61-005000

117-93-448-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,160 24.80
RFQ

-

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-93-648-61-005000

117-93-648-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,694 24.80
RFQ

-

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
514-87-299-20-001117

514-87-299-20-001117

CONN SOCKET PGA 299POS GOLD

Preci-Dip

1,988 24.43
RFQ
514-87-299-20-001117

Datasheet

514 Bulk Active PGA 299 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
299-93-640-10-002000

299-93-640-10-002000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

2,861 12.91
RFQ
299-93-640-10-002000

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
299-43-640-10-002000

299-43-640-10-002000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3,341 24.69
RFQ
299-43-640-10-002000

Datasheet

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
42-3553-11

42-3553-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

3,124 30.16
RFQ
42-3553-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-3554-11

42-3554-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

4,596 30.16
RFQ
42-3554-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
42-6554-11

42-6554-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics

4,608 30.16
RFQ
42-6554-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
110-13-318-61-801000

110-13-318-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,252 24.61
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-11-950-41-001000

123-11-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,438 24.64
RFQ
123-11-950-41-001000

Datasheet

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
514-87-256M20-001148

514-87-256M20-001148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

2,434 22.43
RFQ
514-87-256M20-001148

Datasheet

514 Bulk Active BGA 256 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-87-256M16-000148

514-87-256M16-000148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

3,856 21.93
RFQ
514-87-256M16-000148

Datasheet

514 Bulk Active BGA 256 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-93-642-61-003000

116-93-642-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,980 25.21
RFQ

-

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
714-43-256-31-018000

714-43-256-31-018000

CONN IC DIP SOCKET 56POS GOLD

Mill-Max Manufacturing Corp.

2,330 15.95
RFQ
714-43-256-31-018000

Datasheet

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 56 (2 x 28) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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