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制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
APH-1716-G-H

APH-1716-G-H

APH-1716-G-H

Samtec Inc.

2,108 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
28-6556-21

28-6556-21

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,759 23.19
RFQ
28-6556-21

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
28-6556-31

28-6556-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,469 23.19
RFQ
28-6556-31

Datasheet

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
124-41-648-41-002000

124-41-648-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,069 20.01
RFQ
124-41-648-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-648-41-002000

124-91-648-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,940 20.01
RFQ
124-91-648-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-93-642-41-002000

124-93-642-41-002000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

2,494 19.72
RFQ
124-93-642-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-43-642-41-002000

124-43-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,650 19.72
RFQ
124-43-642-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-83-169-17-101135

546-83-169-17-101135

CONN SOCKET PGA 169POS GOLD

Preci-Dip

2,770 17.23
RFQ
546-83-169-17-101135

Datasheet

546 Bulk Active PGA 169 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-83-169-17-101136

546-83-169-17-101136

CONN SOCKET PGA 169POS GOLD

Preci-Dip

2,897 17.23
RFQ
546-83-169-17-101136

Datasheet

546 Bulk Active PGA 169 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
122-13-328-41-801000

122-13-328-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,179 19.44
RFQ
122-13-328-41-801000

Datasheet

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
546-87-223-18-091135

546-87-223-18-091135

CONN SOCKET PGA 223POS GOLD

Preci-Dip

4,201 17.80
RFQ
546-87-223-18-091135

Datasheet

546 Bulk Active PGA 223 (18 x 18) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
546-87-223-18-091136

546-87-223-18-091136

CONN SOCKET PGA 223POS GOLD

Preci-Dip

4,470 17.80
RFQ
546-87-223-18-091136

Datasheet

546 Bulk Active PGA 223 (18 x 18) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICA-640-ZHGT

ICA-640-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,749 0.00
RFQ
ICA-640-ZHGT

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
115-44-648-61-003000

115-44-648-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,334 22.29
RFQ

-

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APO-628-G-T

APO-628-G-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

3,422 0.00
RFQ
APO-628-G-T

Datasheet

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
115-43-428-61-003000

115-43-428-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,110 22.06
RFQ

-

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-428-61-003000

115-93-428-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,284 22.06
RFQ

-

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
24-C300-31

24-C300-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,090 23.28
RFQ
24-C300-31

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
ICA-648-WGG

ICA-648-WGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

4,600 0.00
RFQ
ICA-648-WGG

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
104-13-950-41-770000

104-13-950-41-770000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

2,731 19.05
RFQ
104-13-950-41-770000

Datasheet

104 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
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