Welcome to Chuangxin Cloud!
Chuangxin CloudUpload BOM Chuangxin CloudMy Account
Chuangxin Cloud Chuangxin Cloud
All Categories
    Language
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    126-43-640-41-002000

    126-43-640-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,121 18.82
    RFQ
    		126-43-640-41-002000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    156-PGM16012-10

    156-PGM16012-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 2,821 20.38
    RFQ
    		156-PGM16012-10

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-93-650-31-007000

    614-93-650-31-007000

    SOCKET CARRIER LOWPRO .600 50POS

    Mill-Max Manufacturing Corp.

    		 1,740 18.02
    RFQ
    		614-93-650-31-007000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-650-31-007000

    614-43-650-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,237 18.02
    RFQ
    		614-43-650-31-007000

    Datasheet

         		614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-424-61-003000

    115-44-424-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,968 20.89
    RFQ

    -

    		 115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-432-61-001000

    110-91-432-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,130 20.64
    RFQ

    -

    		 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-318-61-605000

    110-43-318-61-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,744 20.81
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-91-114-13-062001

    510-91-114-13-062001

    SOCKET SOLDERTAIL 114-PGA

    Mill-Max Manufacturing Corp.

    		 1,332 18.07
    RFQ

    -

    		 510 Tube Active PGA 114 (13 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    48-3570-10

    48-3570-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 3,429 23.92
    RFQ
    		48-3570-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3571-10

    48-3571-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 4,148 23.92
    RFQ
    		48-3571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3572-10

    48-3572-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 1,455 23.92
    RFQ
    		48-3572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3573-10

    48-3573-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 1,833 23.92
    RFQ
    		48-3573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-3575-10

    48-3575-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 3,798 23.92
    RFQ
    		48-3575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6571-10

    48-6571-10

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 4,492 23.92
    RFQ
    		48-6571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6572-10

    48-6572-10

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 2,067 23.92
    RFQ
    		48-6572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6573-10

    48-6573-10

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 3,861 23.92
    RFQ
    		48-6573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6575-10

    48-6575-10

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 4,102 23.92
    RFQ
    		48-6575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-0508-21

    32-0508-21

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 3,927 23.51
    RFQ
    		32-0508-21

    Datasheet

         		508 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    32-0508-31

    32-0508-31

    CONN SOCKET SIP 32POS GOLD

    Aries Electronics

    		 2,331 23.51
    RFQ
    		32-0508-31

    Datasheet

         		508 Bulk Active SIP 32 (1 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    APO-640-G-A

    APO-640-G-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,875 0.00
    RFQ
    		APO-640-G-A

    Datasheet

         		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    Total 19086 Record«Prev1... 747748749750751752753754...955Next»
    One-stop procurement solution
    One-stop procurement solution
    Cost down and save your time
    Cost down and save your time
    Reliable package and fast delivery
    Reliable package and fast delivery
    365 days after-sales service and warranty
    365 days after-sales service and warranty
    Chuangxin Cloud

    HOME

     Chuangxin Cloud

    PRODUCT

     Chuangxin Cloud

    E-mail

     Chuangxin Cloud

    USER
    Chuangxin Cloud
    liujinxin@cxy-sc.com