Welcome to Chuangxin Cloud!

IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































全部重置
应用所有
结果:
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-44-310-61-001000

110-44-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,860 18.27
RFQ

-

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-41-650-41-001000

614-41-650-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,398 17.33
RFQ
614-41-650-41-001000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-650-41-001000

614-91-650-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,408 17.33
RFQ
614-91-650-41-001000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-93-308-61-003000

116-93-308-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,847 19.88
RFQ

-

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-324-G-P

APA-324-G-P

ADAPTER PLUG

Samtec Inc.

3,014 17.27
RFQ
APA-324-G-P

Datasheet

APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
APA-624-G-P

APA-624-G-P

ADAPTER PLUG

Samtec Inc.

4,528 17.27
RFQ
APA-624-G-P

Datasheet

APA Tube Active - 24 (2 x 12) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
614-93-648-31-012000

614-93-648-31-012000

SOCKET CARRIER LOWPRO .600 48POS

Mill-Max Manufacturing Corp.

4,597 17.40
RFQ
614-93-648-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-41-952-41-007000

116-41-952-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,403 17.98
RFQ
116-41-952-41-007000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-952-41-007000

116-91-952-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,223 17.98
RFQ
116-91-952-41-007000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-43-648-31-012000

614-43-648-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,908 17.40
RFQ
614-43-648-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APA-422-G-B

APA-422-G-B

ADAPTER PLUG

Samtec Inc.

2,870 20.18
RFQ
APA-422-G-B

Datasheet

APA Bulk Active - 22 (2 x 11) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
614-41-652-31-018000

614-41-652-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,625 17.50
RFQ
614-41-652-31-018000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-91-652-31-018000

614-91-652-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,518 17.50
RFQ
614-91-652-31-018000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
20-3508-21

20-3508-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,713 23.00
RFQ
20-3508-21

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
20-3508-31

20-3508-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,013 23.00
RFQ
20-3508-31

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
115-43-314-61-001000

115-43-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,927 20.09
RFQ

-

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-93-432-41-003000

126-93-432-41-003000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

3,595 18.57
RFQ
126-93-432-41-003000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-93-632-41-003000

126-93-632-41-003000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

3,195 18.57
RFQ
126-93-632-41-003000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-432-41-003000

126-43-432-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,192 18.57
RFQ
126-43-432-41-003000

Datasheet

126 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
126-43-632-41-003000

126-43-632-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,373 18.57
RFQ
126-43-632-41-003000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
Total 19086 Record«Prev1... 737738739740741742743744...955Next»
One-stop procurement solution
One-stop procurement solution
Cost down and save your time
Cost down and save your time
Reliable package and fast delivery
Reliable package and fast delivery
365 days after-sales service and warranty
365 days after-sales service and warranty
Chuangxin Cloud

HOME

Chuangxin Cloud

PRODUCT

Chuangxin Cloud

E-mail

Chuangxin Cloud

USER