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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
110-43-632-41-801000

110-43-632-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,088 16.36
RFQ
110-43-632-41-801000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
37-0501-20

37-0501-20

CONN SOCKET SIP 37POS TIN

Aries Electronics

3,647 20.87
RFQ
37-0501-20

Datasheet

501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
37-0501-30

37-0501-30

CONN SOCKET SIP 37POS TIN

Aries Electronics

2,970 20.87
RFQ
37-0501-30

Datasheet

501 Bulk Active SIP 37 (1 x 37) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
116-41-648-41-008000

116-41-648-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,911 16.80
RFQ
116-41-648-41-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
116-91-648-41-008000

116-91-648-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,645 16.80
RFQ
116-91-648-41-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-306-61-001000

115-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,492 19.11
RFQ

-

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-306-61-001000

115-93-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,525 19.11
RFQ

-

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-950-41-001000

115-93-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

1,149 16.09
RFQ
115-93-950-41-001000

Datasheet

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-950-41-001000

115-43-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,171 16.09
RFQ
115-43-950-41-001000

Datasheet

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
123-13-424-41-001000

123-13-424-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,408 16.34
RFQ
123-13-424-41-001000

Datasheet

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-41-432-41-002000

124-41-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,530 17.05
RFQ
124-41-432-41-002000

Datasheet

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-41-632-41-002000

124-41-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,423 17.05
RFQ
124-41-632-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-432-41-002000

124-91-432-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,529 17.05
RFQ
124-91-432-41-002000

Datasheet

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-632-41-002000

124-91-632-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,374 17.05
RFQ
124-91-632-41-002000

Datasheet

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-1832-T-T

APH-1832-T-T

APH-1832-T-T

Samtec Inc.

4,285 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0532-T-T

APH-0532-T-T

APH-0532-T-T

Samtec Inc.

2,304 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0932-T-T

APH-0932-T-T

APH-0932-T-T

Samtec Inc.

1,664 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0632-T-T

APH-0632-T-T

APH-0632-T-T

Samtec Inc.

4,409 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0332-T-T

APH-0332-T-T

APH-0332-T-T

Samtec Inc.

4,052 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0832-T-T

APH-0832-T-T

APH-0832-T-T

Samtec Inc.

2,036 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
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