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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1030-T-T

    APH-1030-T-T

    APH-1030-T-T

    Samtec Inc.

    		 4,896 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1530-T-T

    APH-1530-T-T

    APH-1530-T-T

    Samtec Inc.

    		 3,078 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1630-T-T

    APH-1630-T-T

    APH-1630-T-T

    Samtec Inc.

    		 3,705 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1330-T-T

    APH-1330-T-T

    APH-1330-T-T

    Samtec Inc.

    		 4,292 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0830-T-T

    APH-0830-T-T

    APH-0830-T-T

    Samtec Inc.

    		 1,346 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0330-T-T

    APH-0330-T-T

    APH-0330-T-T

    Samtec Inc.

    		 4,853 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1730-T-T

    APH-1730-T-T

    APH-1730-T-T

    Samtec Inc.

    		 3,229 0.00
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    116-41-652-41-003000

    116-41-652-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,587 16.23
    RFQ
    		116-41-652-41-003000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-652-41-003000

    116-91-652-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,247 16.23
    RFQ
    		116-91-652-41-003000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-0503-21

    24-0503-21

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    		 2,476 19.70
    RFQ
    		24-0503-21

    Datasheet

         		0503 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    24-0503-31

    24-0503-31

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    		 2,639 19.70
    RFQ
    		24-0503-31

    Datasheet

         		0503 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    30-0501-21

    30-0501-21

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 4,768 19.32
    RFQ
    		30-0501-21

    Datasheet

         		501 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    30-0501-31

    30-0501-31

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 2,923 19.32
    RFQ
    		30-0501-31

    Datasheet

         		501 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    39-0501-20

    39-0501-20

    CONN SOCKET SIP 39POS TIN

    Aries Electronics

    		 3,311 19.32
    RFQ
    		39-0501-20

    Datasheet

         		501 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-6508-20

    40-6508-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,789 20.22
    RFQ
    		40-6508-20

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-6508-30

    40-6508-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,010 20.22
    RFQ
    		40-6508-30

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-93-608-10-002000

    299-93-608-10-002000

    CONN IC DIP SOCKET 8POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,683 15.44
    RFQ
    		299-93-608-10-002000

    Datasheet

         		299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    20-3508-212

    20-3508-212

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 2,387 20.24
    RFQ
    		20-3508-212

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-3508-312

    20-3508-312

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 1,884 20.24
    RFQ
    		20-3508-312

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-93-642-41-003000

    116-93-642-41-003000

    CONN IC DIP SOCKET 42POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,262 15.92
    RFQ
    		116-93-642-41-003000

    Datasheet

         		116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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