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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
315-99-164-41-003000

315-99-164-41-003000

SOCKET LOW PROFILE SIP 64POS

Mill-Max Manufacturing Corp.

2,083 16.07
RFQ

-

315 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
34-71050-10

34-71050-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

1,662 17.07
RFQ
34-71050-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-71130-10

34-71130-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

1,063 17.07
RFQ
34-71130-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-71250-10

34-71250-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

3,328 17.07
RFQ
34-71250-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
34-7500-10

34-7500-10

CONN SOCKET SIP 34POS TIN

Aries Electronics

4,454 17.07
RFQ
34-7500-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
110-13-428-41-001000

110-13-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

3,285 15.04
RFQ
110-13-428-41-001000

Datasheet

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-93-642-41-001000

115-93-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

2,063 15.25
RFQ
115-93-642-41-001000

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
115-43-642-41-001000

115-43-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,460 15.25
RFQ
115-43-642-41-001000

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-41-642-41-005000

117-41-642-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,113 15.44
RFQ
117-41-642-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
117-91-642-41-005000

117-91-642-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,183 15.44
RFQ
117-91-642-41-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
HLS-0412-S-2

HLS-0412-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

4,579 0.00
RFQ
HLS-0412-S-2

Datasheet

HLS Bulk Active SIP 48 (4 x 12) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
612-93-318-41-001000

612-93-318-41-001000

SOCKET CARRIER SLDRTL .300 18POS

Mill-Max Manufacturing Corp.

4,344 15.68
RFQ
612-93-318-41-001000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
612-43-318-41-001000

612-43-318-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,986 15.68
RFQ
612-43-318-41-001000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-41-320-41-002000

124-41-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,896 15.95
RFQ
124-41-320-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-41-420-41-002000

124-41-420-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,524 15.95
RFQ
124-41-420-41-002000

Datasheet

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-320-41-002000

124-91-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,932 15.95
RFQ
124-91-320-41-002000

Datasheet

124 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
124-91-420-41-002000

124-91-420-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,090 15.95
RFQ
124-91-420-41-002000

Datasheet

124 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-324-31-018000

614-93-324-31-018000

SOCKET CARRIER LOWPRO .300 24POS

Mill-Max Manufacturing Corp.

4,654 15.55
RFQ
614-93-324-31-018000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-424-31-018000

614-93-424-31-018000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

2,002 15.55
RFQ
614-93-424-31-018000

Datasheet

614 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
614-93-624-31-018000

614-93-624-31-018000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,047 15.55
RFQ
614-93-624-31-018000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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