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IC Sockets
| Photo | Mfr. Part # | Availability | Price | Quantity | Datasheet | Series | Packaging | Product Status | Type | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
200-6313-9UN-1900CONN SOCKET PGA ZIF 169POS GOLD 3M |
4,009 | 58.50 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 169 (13 x 13) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
200-6315-9UN-1900CONN SOCKET PGA ZIF 225POS GOLD 3M |
3,968 | 91.84 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100" (2.54mm) | - | - | - | - | - | - | 0.100" (2.54mm) | - | - | - | Polyethersulfone (PES) | -55°C ~ 150°C |
|
200-6317-9UN-1900CONN SOCKET PGA ZIF 289POS GOLD 3M |
2,817 | 73.36 |
|
Datasheet |
Textool™ | Bulk | Obsolete | PGA, ZIF (ZIP) | 289 (17 x 17) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) | -55°C ~ 150°C |
|
100-006-000CONN IC DIP SOCKET 6POS GOLD 3M |
2,162 | 0.00 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
|
|
100-008-000CONN IC DIP SOCKET 8POS GOLD 3M |
4,707 | 0.00 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
|
|
100-008-001CONN IC DIP SOCKET 8POS GOLD 3M |
4,050 | 0.00 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
|
|
100-010-000CONN IC DIP SOCKET 10POS GOLD 3M |
1,130 | 0.00 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
|
|
100-014-000CONN IC DIP SOCKET 14POS GOLD 3M |
4,500 | 0.00 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
|
|
100-014-001CONN IC DIP SOCKET 14POS GOLD 3M |
2,111 | 0.00 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
|
|
100-016-000CONN IC DIP SOCKET 16POS GOLD 3M |
4,057 | 0.00 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | -65°C ~ 125°C |
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