Chuangxin Cloud - IC Sockets - Sockets for ICs, Transistors | Page 2 | Genuine Components, Fast Shipping

Mfr. Part #	Availability	Price	Quantity	Datasheet	Series	Packaging	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
216-3340-00-0602J CONN IC DIP SOCKET ZIF 16POS GLD 3M	565	22.59	RFQ	Datasheet	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
208-7391-55-1902 CONN SOCKET SOIC 8POS GOLD 3M	298	33.65	RFQ	Datasheet	Textool™	Bulk	Active	SOIC	8 (2 x 4)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
248-1282-00-0602J CONN IC DIP SOCKET ZIF 48POS GLD 3M	614	36.49	RFQ	Datasheet	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing	48 (2 x 24)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
216-7224-55-1902 CONN SOCKET SOIC 16POS GOLD 3M	228	37.45	RFQ	Datasheet	Textool™	Bulk	Active	SOIC	16 (2 x 8)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyethersulfone (PES), Glass Filled	-55°C ~ 150°C
203-2737-55-1102 CONN TRANSIST TO-3/TO-66 3POS 3M	2,441	44.28	RFQ	Datasheet	Textool™	Bulk	Active	Transistor, TO-3 and TO-66	3 (Rectangular)	-	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.234" (5.94mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled	-55°C ~ 150°C
264-4493-00-0602J CONN IC DIP SOCKET ZIF 64POS GLD 3M	1,150	56.31	RFQ	Datasheet	Textool™	Tube	Active	DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing	64 (2 x 32)	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Connector	Closed Frame	Press-Fit	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Polysulfone (PSU), Glass Filled	-55°C ~ 125°C
240-5205-01 CONN SOCKET QFN 40POS GOLD 3M	3,081	113.04	RFQ	Datasheet	Textool™	Bulk	Active	QFN	40 (4 x 10)	-	Gold	-	Beryllium Copper	Through Hole	Closed Frame	Solder	-	Gold	-	Beryllium Copper	Polyethersulfone (PES)	-
4808-3000-CP CONN IC DIP SOCKET 8POS TIN 3M	24,688	0.63	RFQ	Datasheet	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
4816-3000-CP CONN IC DIP SOCKET 16POS TIN 3M	11,180	0.63	RFQ	Datasheet	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C
4814-3004-CP CONN IC DIP SOCKET 14POS TIN 3M	9,841	0.63	RFQ	Datasheet	4800	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	35.4µin (0.90µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	35.0µin (0.90µm)	Phosphor Bronze	Polyester, Glass Filled	-25°C ~ 85°C

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