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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
HLS-0111-G-3

HLS-0111-G-3

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,804 0.00
RFQ
HLS-0111-G-3

Datasheet

HLS Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
38-3503-20

38-3503-20

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

1,472 18.22
RFQ
38-3503-20

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
38-3503-30

38-3503-30

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

1,947 18.22
RFQ
38-3503-30

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
40-6503-30

40-6503-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,322 18.22
RFQ
40-6503-30

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-516-11M

24-516-11M

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,770 13.72
RFQ
24-516-11M

Datasheet

516 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
115-47-652-41-001000

115-47-652-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

3,884 14.39
RFQ
115-47-652-41-001000

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
42-1508-20

42-1508-20

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

2,109 18.24
RFQ
42-1508-20

Datasheet

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
ICO-628-CGG

ICO-628-CGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

1,896 0.00
RFQ
ICO-628-CGG

Datasheet

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
APA-628-G-J

APA-628-G-J

ADAPTER PLUG

Samtec Inc.

2,150 0.00
RFQ
APA-628-G-J

Datasheet

APA Bulk Active - 28 (2 x 14) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
111-41-640-41-001000

111-41-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,065 14.32
RFQ
111-41-640-41-001000

Datasheet

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
111-91-640-41-001000

111-91-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,876 14.32
RFQ
111-91-640-41-001000

Datasheet

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
104-13-314-41-780000

104-13-314-41-780000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

3,184 14.20
RFQ
104-13-314-41-780000

Datasheet

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
16-C280-20

16-C280-20

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,293 15.11
RFQ
16-C280-20

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
24-6508-202

24-6508-202

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

2,914 15.11
RFQ
24-6508-202

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
146-93-422-41-012000

146-93-422-41-012000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

4,690 14.01
RFQ
146-93-422-41-012000

Datasheet

146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
146-43-422-41-012000

146-43-422-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

1,708 14.01
RFQ
146-43-422-41-012000

Datasheet

146 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
APH-0930-T-T

APH-0930-T-T

APH-0930-T-T

Samtec Inc.

1,471 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0530-T-T

APH-0530-T-T

APH-0530-T-T

Samtec Inc.

1,233 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-0630-T-T

APH-0630-T-T

APH-0630-T-T

Samtec Inc.

4,750 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
APH-1230-T-T

APH-1230-T-T

APH-1230-T-T

Samtec Inc.

3,052 0.00
RFQ

-

* - Active - - - - - - - - - - - - - - -
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