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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    115-41-636-41-001000

    115-41-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,881 13.81
    RFQ
    		115-41-636-41-001000

    Datasheet

         		115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-91-636-41-001000

    115-91-636-41-001000

    SKT IC OPEN LOWPRO

    Mill-Max Manufacturing Corp.

    		 1,258 13.81
    RFQ
    		115-91-636-41-001000

    Datasheet

         		115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-280-18-101111

    517-87-280-18-101111

    CONN SOCKET PGA 280POS GOLD

    Preci-Dip

    		 3,645 11.06
    RFQ
    		517-87-280-18-101111

    Datasheet

         		517 Bulk Active PGA 280 (18 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    111-47-640-41-001000

    111-47-640-41-001000

    STANDRD SOLDRTL DBL SKT

    Mill-Max Manufacturing Corp.

    		 1,454 13.89
    RFQ
    		111-47-640-41-001000

    Datasheet

         		111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-93-314-31-007000

    614-93-314-31-007000

    CONN IC DIP SOCKET 14POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,333 13.84
    RFQ
    		614-93-314-31-007000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-314-31-007000

    614-43-314-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,304 13.84
    RFQ
    		614-43-314-31-007000

    Datasheet

         		614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-41-422-41-605000

    110-41-422-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,522 13.88
    RFQ
    		110-41-422-41-605000

    Datasheet

         		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-422-41-605000

    110-91-422-41-605000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,700 13.88
    RFQ
    		110-91-422-41-605000

    Datasheet

         		110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-256-16-000101

    510-83-256-16-000101

    CONN SOCKET PGA 256POS GOLD

    Preci-Dip

    		 1,935 10.72
    RFQ
    		510-83-256-16-000101

    Datasheet

         		510 Bulk Active PGA 256 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-93-318-41-012000

    146-93-318-41-012000

    CONN IC DIP SOCKET 18POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,576 13.77
    RFQ
    		146-93-318-41-012000

    Datasheet

         		146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-43-318-41-012000

    146-43-318-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,075 13.77
    RFQ
    		146-43-318-41-012000

    Datasheet

         		146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-93-320-41-012000

    146-93-320-41-012000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,646 13.67
    RFQ
    		146-93-320-41-012000

    Datasheet

         		146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    146-43-320-41-012000

    146-43-320-41-012000

    CONN SKT DBL

    Mill-Max Manufacturing Corp.

    		 1,008 13.67
    RFQ
    		146-43-320-41-012000

    Datasheet

         		146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-143-31-018000

    714-43-143-31-018000

    CONN SOCKET SIP 43POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,103 11.12
    RFQ
    		714-43-143-31-018000

    Datasheet

         		714 Bulk Active SIP 43 (1 x 43) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICA-648-SGG-L

    ICA-648-SGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 3,489 0.00
    RFQ
    		ICA-648-SGG-L

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    21-0508-21

    21-0508-21

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    		 3,137 17.58
    RFQ
    		21-0508-21

    Datasheet

         		508 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    16-C195-21

    16-C195-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 4,220 17.58
    RFQ
    		16-C195-21

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-C195-31

    16-C195-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 2,687 17.58
    RFQ
    		16-C195-31

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-C280-21

    16-C280-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 3,777 17.58
    RFQ
    		16-C280-21

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    16-C280-31

    16-C280-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 1,824 17.58
    RFQ
    		16-C280-31

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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