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IC Sockets

制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
24-0518-00

24-0518-00

CONN SOCKET SIP 24POS GOLD

Aries Electronics

2,452 6.06
RFQ
24-0518-00

Datasheet

518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
24-1518-00

24-1518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,841 6.06
RFQ
24-1518-00

Datasheet

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
04-71000-10

04-71000-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

4,961 6.18
RFQ
04-71000-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
04-7350-10

04-7350-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

3,221 6.18
RFQ
04-7350-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
04-7360-10

04-7360-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

4,220 6.18
RFQ
04-7360-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
04-7375-10

04-7375-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2,440 6.18
RFQ
04-7375-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
04-7380-10

04-7380-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

2,539 6.18
RFQ
04-7380-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
04-7400-10

04-7400-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

4,376 6.18
RFQ
04-7400-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
04-7422-10

04-7422-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

1,262 6.18
RFQ
04-7422-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
04-7430-10

04-7430-10

CONN SOCKET SIP 4POS TIN

Aries Electronics

4,185 6.18
RFQ
04-7430-10

Datasheet

700 Elevator Strip-Line™ Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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